February, 2019
www.us-tech.com
Page 117 Rehm Develops Interface for M2M Communications
Roswell, GA — Alongside other manufacturers of SMT production equipment, Rehm has been work- ing intensively to develop a digital interface for machine-to-machine (M2M) communications within the production line. So far, the reflow soldering system has been a sticking point in the way of a seamless digital interface. This is because the reflow process
involves several assemblies at the same time. It is important to identify these clearly after the soldering process, in order to reliably assign each unit’s information. The barcode on the assembly, the Hermes board ID number and the assembly data can now be communicated. Assembly data includes width, length, weight, speed, good/bad, orientation, thickness, and both top and bottom clearance heights. If there is no scanner on the outfeed con-
veyor, assemblies cannot be removed or inserted (reinserted). This is ensured by a cover on the outfeed conveyor, which prevents boards from being taken out or inserted. This guarantees that no data is lost or assigned to the wrong assembly. With a scanner affixed to the
outfeed conveyor, boards can be removed after the soldering process and reused. The data will always remain assigned to the correct board.
MRSI Systems Highlights HVM3 Die Bonding Process
North Billerica, MA — MRSI Systems, a part of Mycronic Group, is now demonstrating its MRSI-HVM3 die bonder and die bonding process in Shenzhen, China. This demonstra- tion offers existing and prospective customers in China the opportunity to review the detailed performance capability of the MRSI-HVM3 in a local setting, supported by MRSI’s world-class application engineers for quick turnaround product demon- strations and die bonding samples. The MRSI-HVM3 product fami-
ly delivers speed, future-proofing, high precision, and flexibility for multi-process, multi-chip, high-vol- ume production. Performance is enabled by a dual-head, dual-stage, integrated, on-the-fly tool changer, ultrafast eutectic stage, and many levels of parallel processing opti- mizations. The MRSI-HVM3 is designed
for specific applications that include chip-on-carrier (CoC), chip-on-sub- mount (CoS), and chip-on-baseplate (CoB) assembly using eutectic and/or epoxy stamping die bonding. MRSI also offers extended product configu- rations, including HVM3e, HVM3P, H3TO, and H3LD. These configurations are based
upon the same design as HVM3 but configured specifically for local top heating, inline conveyor CoB, AOC and gold-box packaging, WDM and EML TO-can packaging, and high-power
laser diode packaging, respectively. Contact: MRSI, 101 Billerica
Avenue #3, North Billerica, MA 01862 % 978-667-9449 E-mail:
sales@mrsisystems.com Web:
www.mrsisystems.com
See Mycronic at IPC APEX, Booth 2141
See at IPC APEX, Booth 901
This allows for manual visual inspection of assem- blies, as well as sampling, for quality assurance.
Rehm also integrated a separate transport
into the outfeed area after the cooling section, which only extends the overall length of the machine by 20 in. (50 cm). The Hermes standard offers an over-
reaching protocol, irrespective of manufac- turer, for M2M communications in manufac- turing. The objective is to improve or simpli- fy board flow management, traceability and electrical wiring across all stations of an SMT line. Modern communication technology and standardized data formats for M2M commu-
nication (TCP/IP and XML) are used. Contact: Rehm Thermal Systems, LLC,
Hermes outfeed conveyor on a VisionXP+ reflow soldering system.
3080 Northfield Place, Suite 109, Roswell, GA 30076 % 770-442-8913 E-mail:
p.handler@rehm-group.com Web:
www.rehm-group.com
See at IPC APEX, Booth 4215
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