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www.us-tech.com
Glassboro, NJ — Essemtec is pre- senting a large, all-in-one platform that can be used for high-speed assembly applications, rapid proto- typing and high-speed dispensing. The company will also demonstrate
February, 2019 Essemtec Unveils Advanced New FOX Platform
and suiting it for use in small- to medi- um-volume production. Essemtec’s Puma is a high-
speed pick-and-place solution that can also be used in the ultra-flexible prototype development sector. With an IPC assembly performance of 18,100 CPH, the machine push- es further into the midrange field. To increase flexibility it offers up to 280 feeder positions and processes PCBs up to 2 x 5.9 ft (0.6 x 1.8m) in size. Aside from assembly, the
FOX2 pick-and-place system.
two FOX2 systems — one with a jet valve and one that combines jetting/dispensing, 2.5D placement, electrical testing, inventory control, and traceability in a single machine. The FOX2 has a machine foot-
print of only 10.8 ft2 (1m2) and can accept PCB sizes up to 12 x 16 in. (30.5 x 40.6 cm). It places components from 01005 (0402 metric) up to 1.3 x 3.1 in. (3.3 x 7.9 cm). The system achieves 10,800 CPH, per IPC9850, with 2 mil accuracy (50 µm), at three sigma, with a two-nozzle head. The system is also the first plat-
form in its class to have linear motors and a mineral cast frame, providing excellent speed, stability, accuracy,
machine also dispenses and jets in parallel up to 150,000 dots per hour. When all three axes are used exclusively for dispensing fluids, the system is called Tarantula. There are five valve technologies to choose from and with plug-and-play parts, all heads can be retrofitted or changed over onsite. The new implemented lin-
ear motor technology, paired
with “Epument” material for the mineral cast frame, offers a speed increase of up to 52.5 percent over the previous model. Enhanced vibra- tion absorption through the mineral cast frame offers high and consistent accuracy over many years of use. Replacing traditional spindles
and bells with the linear motor tech- nology significantly reduces mainte- nance. Assembly and dispensing processes are displayed on the same x/y system. The system’s software has also
been upgraded. The clearly structured interface on a large touchscreen moni- tor is as easy to operate as a smart- phone. This enables the operator to
process simple assembly groups, as well as more complex projects with mixed processes, 2.5D applications and more, directly on the machine. Management can check the efficiency of the machine at any time. Essemtec also offers online support.
Contact: Essemtec USA, 816 N.
Delsea Drive, Suite 308, Glassboro, NJ 08028 % 856-218-1131 E-mail:
info@essemtec-usa.com Web:
www.essemtec-usa.com
See at IPC APEX, Booth 2301 KIC: Data Analytics Platform for Smart Reflow
San Diego, CA — KIC is now offering its RPI i4.0, an easy-to-use, built-in solution for automation, traceability, advanced reflow data collection, and sharing for smart factory integra- tion. KIC RPI i4.0 automatically acquires profile data from each PCB soldered in the reflow or curing oven. This new ecosystem offers a
real-time thermal process dash- board and traceability, reduced scrap and rework, fast defect troubleshooting, lower electricity use, and more. Advanced data search and communication fea- tures save engineers valuable time.
With RPI i4.0, all relevant
data can connect to the factory MES or customer’s factory data collection system to be easily shared with personnel, and can be accessed from any authorized PC or mobile device. The enhanced level of automation delivers improved line utilization and productivity. The company has also intro-
duced its Smart Reflow Analyzer (SRA), a next-generation reflow and
RPI i4.0 data analytics solution.
smart factory. Contact: KIC Thermal, 16120
W. Bernardo Drive, San Diego, CA 92127 % 858-673-6050 fax: 858-673-0085 E-mail:
abailey@kicmail.com Web:
www.kicthermal.com
See at IPC APEX, Booth 1215
curing oven stability tool. KIC’s ecosystem offers solutions to reduce downtime, speed reflow oven set up, provide automation, and integrate data collection and analytics into the
See at IPC APEX, Booth 1123, and at ATX / MD&M West, Booth 681 1 1 2:29 PM
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