February, 2019


Ann Arbor, MI — Aven has introduced its ZEN Mount, a highly versatile, lightweight, multi-angle, telescoping mount that affixes to inspection cameras for optimal maneuver- ability. The ball joint at the base of the mount provides nearly limitless positioning options. A second ball joint at the top of the


stand fastens to the camera with a univer- sal 0.25 in. (6.4 mm) screw and can also be angled in virtually any position. The ZEN Mount has a telescoping


arm, with an extended reach of roughly 12 to 16 in. (30.5 to 40.6 cm), which is adjust- ed by a twist lock. The industry-standard screw mount is compatible with Aven digi- tal cameras, retail cameras, DSLRs, as well as the company’s Cyclops digital micro- scopes. The mount can be stationed at near- ly any angle, which makes it easy to place out of the way when not in use, sav-


EpoxySet Introduces High-Temp Optoelectronic Adhesive


Woonsocket, RI — EpoxySet is now offering its EB-177, a low-viscosity epoxy used in optoelectronic applica- tions, especially where high tempera- tures must be endured. The EB-177 is rated for continuous use at 482°F (250°C) and intermittently to 572°F (300°C). This clear epoxy system offers excellent optical transmission of over 95 percent at 1,500 nm with a refractive index of 1.52. Approved to


www.us-tech.com


Page 87 Aven Now Offering Telescoping Camera Mount


ing work space. Aven also offers four different bun-


dles of ZEN Mount systems: the Cyclops USB and HDMI ZEN Mount system; Cyclops HDMI digital microscope ZEN Mount system; Cyclops MACRO digital microscope ZEN Mount system; and a Mighty Cam autofocus ZEN Mount sys- tem. The included heavy-duty table clamp secures to the edge of any counter, work- bench or table with a maximum opening of


3 in. (7.6 cm). Contact: Aven, Inc., 4330 Varsity


Drive, Ann Arbor, MI 48108 % 734-973-0099


E-mail: sales@aveninc.com Web: www.aveninc.com


ZEN Mount telescoping camera mount.


See at IPC APEX, Booth 1101 and at ATX/MD&M West, Booth 4615


EB-177 clear optoelectronic adhesive.


USP Class VI for biocompatibility, it is used in medical device applications where high strength at elevated tem- peratures is required. It exhibits low cure shrinkage to maintain precise optical alignments and to minimize stress on delicate parts. This highly formulated polymer


produces outstanding dielectric and electrically insulative properties allowing for use in small electronic pottings. It is also useful for under- fill, die attach and flip chip applica- tions. Chemical resistance, as well as the ability to withstand autoclaving, ETO and gamma radiation, make this versatile product useful in many different industries. EB-177 was designed to be easy


to use. It has a 1:1 mix ratio with a 12-hour work time, reducing waste and increasing efficiency in produc-


tion environments. Contact: EpoxySet, Inc., 718


Park East Drive, Woonsocket, RI 02895 % 401-726-4500 E-mail: info@epoxyset.com Web: www.epoxyset.com


See at ATX/MD&M West, Booth 744


See at IPC APEX, Booth 441, and at ATX / MD&M West, Booth 1804


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