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www.us-tech.com
Cypress, CA — Techcon is highlighting its TSR2000 smart dispensing robots, TS8100-100 PC pump with new controller and TS5000DMP-DCX valve at IPC APEX 2019. TSR2000 series dispensing robots are
designed specifically for precise fluid dispensing applications and are compatible with all valve types and controllers. The user-friendly, smart PC- based software makes the robots easy to program and simple to operate. From a general assembly manufacturer looking
to automate an existing dispensing application to an engineer designing a production process from the very beginning, Techcon Systems dispensing robots offer excellent value for automated precision fluid dispensing. The basic dispensing robots are avail- able in three platforms: TSR2201 — 7.9 x 7.9 in. (20 x 20 cm), TSR2301 —11.8 x 11.8 in. (30 x 30 cm), and TSR2401 — 15.8 x 15.8 in. (40 x 40 cm).
TS8100-100 positive displacement PC pump
is a continuously volumetric pump based on pro- gressive cavity (PC) technology. The pump can accurately dispense a wide range of fluids, from
February, 2019 Techcon Brings Smart Dispensing Robots to APEX
low-viscosity coatings to high-viscosity greases. The TS580R is a PC pump controller capable of controlling the Techcon TS8100 series PC pump. With a universal power supply, it is a fully plug- and-play system that can be used immediately, anywhere in the world. The TS5000DMP-DCX is a disposable materi-
al path rotary valve equipped with a quick-access hinged door, for rapid feed-path replacement. Techcon’s patented disposable material path (DMP) valve contains a disposable feed screw for easy maintenance and reliable dispensing. With the feed screw made of Delrin®, the valve is designed for use with two-component and UV-
cured fluids. Contact: Techcon, 10800 Valley View Street,
TSR2000 series robotic dispensing system.
Cypress, CA 90630 % 714-230-2398 E-mail:
jsimmons@okinternational.com Web:
www.techcon.com
See at IPC APEX, Booth 1314, and at ATX/MD&M West, Booth 3063
SHENMAO Debuts Lead-Free Solder Wire
San Jose, CA — SHENMAO has introduced its PF606-F13 solder wire, a lead- and halogen-free wire designed for automatic soldering equipment. The company is also offering its PQ10 series low-tempera- ture solder paste. PF606-F13 is designed to
improve the working environment for a variety of automatic soldering applications, including TPC, buzzer, bending element, LCD panel, embed- ded element, joints, wire soldering, button, screen connector, and FPC soldering.
PF606-F13 solder wire. Benefits include: improved
working environment for employees; reduction of technical requirements for manual operation; enhanced high-precision soldering; stable sol- dering quality; enhanced soldering efficiency; and mass production. PQ10 series low-temperature
solder paste is made with the modi- fied Sn/Bi alloy with lower melting point range from 279 to about 288°F (137 to about 142°C) to 279 to about 338°F (137 to about 170°C). In com- parison with SnAgCu, PQ10 offers reduced peak reflow temperature, energy consumption, and warpage of PCBs and components. In comparison with the Sn42/Bi58 eutectic alloy, PQ10 series offers better ductility, finer microstructure, and increased
drop and thermal reliability. Contact: SHENMAO America,
Inc., 2156 Ringwood Avenue, San Jose, CA 95131 % 408-943-1755 E-mail:
watson_tseng@shenmao.us Web:
www.shenmao.com
See at IPC APEX, Booth 1304
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