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February, 2019


www.us-tech.com


West Conshohocken, PA — In additive manufacturing of highly conductive copper components Heraeus can now achieve 99.8 percent density and approx- imately 95 percent conductivity IACS (International Annealed Copper Standard) using standard powder bed laser melting machines. With this development, the technology


group is opening up new industrial fields of application for the manufacturing process of components used in mobile communication devices, consumer electronics and electromobil- ity. Sourcing replacement parts is reduced from several months to a few days. Examples of applications include compo-


nents in the areas of electric drives, inductive heating, thermal management, and other applications that require the electrical and thermal characteristics of copper. In conven- tional manufacturing processes, tolerances are often too high to achieve reproducibility in par- ticularly sensitive processes. Copper has high conductivity and ductility,


but reflects the laser wavelength that is used in standard machines, almost like a mir- ror. At the same time, the high thermal


Indium Highlights Ultra-Reliable Solder Paste


Clinton, NY — Indium Corporation is now offering its Indium8.9HF solder paste. The solder paste is an air- reflow, no-clean solder paste specially


Page 89 Heraeus Boosts Quality of 3D-Printed Copper


conductivity of copper causes quick dissipation of the coupled energy. This results in a very narrow process window. Conventional 3D printing of pure copper is impossible, because of these characteristics. So far, one approach to solving this problem has consisted of using various copper alloys — in each case at the expense of conductivity and other characteristics like resistance to corrosion. Another approach is to modify the manu-


facturing process, but can compromise compo- nent quality. For example, components can exhibit greater porosity if the laser beam only begins to melt the material but does not melt it completely. A third approach is to use other kinds of laser sources, which do not yet exist


commercially. Contact: Heraeus, Inc., 24 Union Hill


Road, West Conshohocken, PA 19428 % 215-944-9981


8:18 PM 3D-printed copper components.


E-mail: jeffery.oddo@heraeus.com Web: www.heraeus-electronics.com


See at IPC APEX, Booth 4021


See us at APEX, Jan 29-31, 2019 Booth 3405


Indium8.9HF solder paste.


formulated to enhance electrical relia- bility and eliminate dendritic growth in high-power products, such as auto- motive electronics manufacturing. Reliability is a must-have for


electronics to work properly, espe- cially when issues like ionic contami- nation under low-standoff compo- nents can cause dendritic growth. Indium8.9HF offers increased


reliability through enhanced surface insulation resistance (SIR) that inhibits current leakage and den- drite growth. It also offers thermal reliability, due to its low-voiding per- formance on bottom-terminating components (BTCs), reducing the risk of application or product failure. Indium8.9HF can accommodate


the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace con-


ventional lead-bearing solders. Contact: Indium Corp., 34


Robinson Road, Clinton, NY 13323 % 315-381-7524


E-mail: abrown@indium.com Web: www.indium.com


See at IPC APEX, Booth 3133 See at IPC APEX, Booth 3405


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