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February, 2019


www.us-tech.com KIC Earns Calsonic Facility Quality Award Continued from previous page


matic profiling systems for reflow, which use per- manently embedded sensors in the oven to calcu- late each PCB’s profile on the fly during produc- tion. The automatic profiling systems were retro- fittable on all of Calsonic’s reflow ovens regardless of age, providing consistent process tracking and traceability across all lines. To test the non-contact profile accuracy and


repeatability, Calsonic’s engineers forced changes in the oven while verifying that the system did in- deed correctly identify the resulting out-of-spec event.They also found it interesting that they could stop a blower motor in the reflow oven with- out triggering an oven alarm or notification. This was probably because the temperature did not change. But, the convection rate had changed, causing the profile on the PCBs to change, which is what determines in-spec production. The automatic system allowed


Calsonic to control and document the reflow process. In addition to full thermal process traceability, the sys- tem will instantly alarm on an out-of- spec event. It will also provide SPC charting with Cpk limits that provide


from data to insight. It is easy to capture massive volumes of data, but a strong browser or analytical tool is necessary to identify the relevant information. With KIC’s tools, the company was also able


to improve uptime by several hours each time it had to run a profile when a thermocouple broke or a profile board was damaged. Previously, if the company had such an event, on the night shift, for example, it had to shut down the line until a pro- file verification could be performed.


Calsonic’s Competition Each year, Calsonic conducts an internal


competition to reward improvements in two main categories. These are quality, which includes im- provements and assurance, and cost reduction, which includes cost savings and time savings. With KIC’s smart profiler, the Lewisburg plant won the regional Calsonic contest. Reasons


for winning included: out-of-spec profiles all but disappeared; automatic verification of process ad- herence; effective void reduction; near elimination of periodic profiling downtime that led to an in- crease in production time; improved set up times for NPI; line utilization gains in multiple minutes for preventive maintenance, troubleshooting yield issues and unscheduled stoppage; full thermal process traceability for every produced PCB; and dramatic decrease of production downtime. Contact: Calsonic Kansei North America,


Inc., One Calsonic Way, Shelbyville, TN 37162 % 931-684-4490 Web: www.calsonic.com and KIC Thermal, 16120 W. Bernardo Drive,


San Diego, CA 92127 % 858-673-6050 fax: 858-673-0085 E-mail: abailey@kicmail.com Web: www.kicthermal.com r


See at IPC APEX, Booth 1215


Page 21


Sampson says KIC has


drastically cut thermal profile optimization times.


early warning on an out-of-control re- flow process. The company was able to replace manual verification profile spot checks with on-the-fly profiling of every PCB.


A Wealth of Data However, it was challenging to


make use of the thermal process data for trend analysis, yield troubleshoot- ing and other issues, due to the sheer volume of data on every reflow oven PC. In the past, it could take the en- gineers at the company more than a day to put together a trend analysis report to gain the appropriate insight to take corrective action on a yield is- sue. When the line is down, the com- pany is keenly aware that every sec- ond is expensive. SPI and AOI in- spections are very helpful. Some- times, the root cause of the problem is obvious. Other times it is not. Fortunately, the company uses


KIC’s Vantage, which is factory-level database software that makes access- ing relevant data quick and conven- ient. Now, Calsonic can identify the thermal process for a specific PCB or time period with a deteriorating pro- duction line yield. The company can quickly rule the thermal process in or out, reducing troubleshooting time. If reflow is the problem, which happens infrequently, then the automatic pro- filing system points the process engi- neers to where and what in the oven needs to be adjusted. This progression made Calsonic’s


engineers realize how much timely re- flow data was lacking. Suddenly, they had so much data that they were not able to take corrective action quickly enough. The introduction of Vantage changed that by providing a bridge


See at IPC APEX, Booth 1933


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