search.noResults

search.searching

dataCollection.invalidEmail
note.createNoteMessage

search.noResults

search.searching

orderForm.title

orderForm.productCode
orderForm.description
orderForm.quantity
orderForm.itemPrice
orderForm.price
orderForm.totalPrice
orderForm.deliveryDetails.billingAddress
orderForm.deliveryDetails.deliveryAddress
orderForm.noItems
Page 64


www.us-tech.com


February, 2019


Pinning Down Defects in Press-Fit Assembly


By Jenny Yuh, Marketing Assistant, Koh Young Technologies D


ue to the rapid electrification of vehicles, automotive safety systems are coming under increased scrutiny. Electronics manufactur-


ers are introducing new safety systems and solu- tions, which must be high-quality, reliable and environmentally friendly. Maintaining a balance between cost and quality is always a challenge in this market. Improving the overall backend process of elec-


tronics manufacturing can resolve some of these issues, while broadening profit margins. During this final stage, manufacturers add high-value components and packages to the assembly. This is where the press-fit operation truly shines. Press-fit technology is a lead-free, solder-


less electrical assembly process where a mechanically compliant pin is inserted into a PCB’s plated through hole (PTH). While this process has many advantages over soldering, it is challenging to ensure minimal defects, due to board complexity. As a single defect in the auto- motive industry can result in fatal vehicle acci- dents and hundreds of thousands of recalls, it is crucial to catch these defects early.


Press-Fit vs. Soldering The soldering process provides a cost-


effective and reliable way to connect electrical wiring and components to a PCB. However, the shift toward lead-free soldering placed a sub- stantial economic burden on manufacturers as they moved to use more expensive plastics, such as liquid crystal polymer (LCP), p-pheny- lene sulfide (PPS) and polyphthalamide (PPA) to cope with higher soldering temperatures. Press-fit technology does not use solder alloy.


Instead it uses compliant pins with slightly larger diameter than the PTH. This press-fit process eliminates common soldering problems, such as cold joints, solder bridging and other defects. According to IEC 1709, press-fit connections


are at least 10 times more reliable than soldering. As such, the pin-insertion machine market has seen a compound annual growth rate of 4.9 percent since 2016, and is expected to reach $276.7 million by 2022.


Need for Accurate Inspection Pin connections for electronics modules often


occur near the end of the final assembly process. But, if defects are discovered at this stage, the PCB must undergo rework, or in some cases, be scrapped altogether. Therefore, manufacturers must accurately


inspect the boards beforehand. Various testing methods are available, such as manual inspection, electrical test, X-ray inspection, and more. Some techniques are becoming obsolete as board com- plexity continues to increase. Some PCBs can have


Fork pin measurement made with Koh Young's KY-P3 3D pin inspection system.


tem is designed to identify common defects, such as missing or potential pin offsets, as well as to identify coplanarity by measuring pin-to-pin distance. Like its other AOI systems, the KY-P3 uses


Koh Young’s patented, shadow-free, moiré technol- ogy to measure the z-axis profilometry of the entire board. Koh Young uses the height threshold to extract the pin body and pin tip information. This dataset allows the KY-P3 to provide a reliable pin height and offset measurement with CAD dimen- sions, because it accurately locates the pin body during the very first stage of the inspection process.


Flexibility and Accuracy The real strength of the KY-P3 lies in its


height measurement, which guarantees high accu- racy for any pin up to 1 in. (25 mm) in height. Measuring pins with angled or pointed tips is more difficult than those with flat tips. The KY-P3 uses a height range algorithm that sets a minimum and maximum height to calculate the average height. Using a relatively large height range, manufactur- ers can obtain accurate height information for sharp pin tips. Accurately extracting the pin tip translates to


See at IPC APEX, Booth 1908 Fork pins mounted on a PCB.


Koh Young’s KY-P3 is designed to not only pin down defects, but improve the entire manufactur-


ing process. Contact: Koh Young America, Inc., 6150 W.


Chandler Boulevard, Suite 39, Chandler, AZ 85226 % 480-403-5000 fax: 480-403-5001 E-mail: america@kohyoung.com Web: www.kohyoung.com r


over 100,000 connector pins. These pins are getting shorter and smaller.


Traditional methods can no longer detect crushed or bent pins. AOI is one solution. The camera autonomously scans the board and can detect most of the backplane faults, including critical defects (missing pins) and quality concerns (deviated or bent pins). Koh Young has developed its KY-P3 pin inspec- tion solution for these types of applications. The sys-


an accurate pin offset measurement. Manu - facturers use a specific vertical distance below the pin tip to locate a suitable measurement plane that reflects the full pin. Then, the calculated cen- ter point of the measurement plane is used as a reference point to measure the absolute and rela- tive pin-to-pin distances. Ultimately, the KY-P3 is designed to help manufacturers ensure maximum alignment accuracy, which is essential to produce high-quality PCBs.


Increased Efficiency.


The drive to improve profitability never slows. The synergy between the KY-P3 system and the Koh Young KSMART software allows manufacturers to improve the overall process. Manufacturers can monitor the pin-insertion machine performance in real-time, using RTM@KSMART. This software module allows users to monitor and manage Cpk


data by part,


job or fixture, in real time. Further, SPC@KSMART instantly visualizes analyzed data with relevant indicators, such as yield rate, NG analysis, PPM analysis, Gage R&R, offset analysis, and more. The KY-P3 can generate a significant set


of reliable measurement data to help manu- facturers optimize the pin-insertion machine fixture and adjust tolerances to meet cus- tomers’ specific Cpk


levels. Combining


KSMART and the KY-P3 can help manufac- turers accelerate productivity improvements, reduce the ROI and realize the smart factory. The press-fit operation is becoming more


prevalent in the market, due to its many advan- tages over traditional soldering. However, it is becoming more challenging to inspect press-fit defects, since the pin dimensions are shrinking and placement density is increasing. The industry requires a high-precision inspection solution to overcome these challenges.


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100  |  Page 101  |  Page 102  |  Page 103  |  Page 104  |  Page 105  |  Page 106  |  Page 107  |  Page 108  |  Page 109  |  Page 110  |  Page 111  |  Page 112  |  Page 113  |  Page 114  |  Page 115  |  Page 116  |  Page 117  |  Page 118  |  Page 119  |  Page 120  |  Page 121  |  Page 122  |  Page 123  |  Page 124  |  Page 125  |  Page 126  |  Page 127  |  Page 128  |  Page 129  |  Page 130  |  Page 131  |  Page 132  |  Page 133  |  Page 134  |  Page 135  |  Page 136