March, 2014
www.us-tech.com
Page 81
Garden Grove, CA — Metcal is introducing its new MX-500 Soldering and Rework System, HCT2-120 Hot Air Pencil and Side-View Camera Upgrade Kit for the Scorpion. The updated MX-500 Soldering and Rework System builds on previ- ous models adding features and updating its appearance with an exciting new look. The sys- tem utilizes SmartHeat® Technology wherein each cartridge is equipped with a self-regulat- ing heater that “senses” its own temperature and closely maintains its preset idle tempera- ture for the life of the heater-tip. The MX-500 retains dual port, switchable
40W operation in a new housing, while intro- ducing numerous new features including: inte- grated power indication meter, user program- mable PowerSave mode, ground fault interrupt, universal power supply and compatibility with existing MX-5200 products. The company’s HCT2-120 Hot
Air Pencil is a new addition to its offering of convection rework tools. The hot air pencil, a handheld con- vection tool, is ideally suited for applications that use smaller compo- nents and integrated circuits. As component miniaturization contin- ues, the ergonomics of a pencil allow a user more freedom to access and rework components on the board, without affecting adjacent parts. The
Open Cavity QFN for
Prototyping from Mirror Semiconductor
Irvine, CA — New from Mirror Semi - conductor, Open Cavity QFN is a new way to make prototype IC and small production series with applica- tion for MEMS, sensors and RF-IC packages. The cavity wall is 0.635mm high, and 40 open tool
Metcal: New Rework Product Family
HCT2-120 uses a 120-watt ceramic heater and dual-stage air pump, digital airflow and tempera- ture controls, fast response and performance,
standby mode and universal power supply. Also on display, the Side-View Camera Upgrade Kit (APR- SRS-UK3) was specially designed for the modular Metcal Scorpion Rework System. It facili- tates visibility of reflow during the rework process and provides the operator with an improved method of setting placement height of the vacuum and reflow nozzles. The upgrade kit features high magnification optics, a CMOS sensor camera with USB 2.0 connection, and picture-in-picture function- ality accessed through the Scorpion soft- ware, eliminating the need for a second monitor.
Garden Grove, CA 92841 % 714-799-9910 Web:
www.metcal.com
Contact: Metcal, 12151 Monarch St., Updated rework products. See at IPC/APEX Booth #2225.
Open cavity QFN for prototyping.
packages are in production, with pinouts from 8 to 100 pins. The size is 3 x 3 to 12 x 12mm,
and pitch is from 0.4 to 0.8mm. The cavity wall molding compound is EME-G770 Sumitomo Bakelite. The Cu lead-frame plating is NiPdAu. The operating temperature range is –40 to +125°C. The open cavity pack- age solders to PCBs with SAC305 solder paste. The silicon die is bond- ed in the center of the package with wire bonding to the pins. A flat cover may be attached or filled with epoxy modeling compound to cover the die. A dome cover on top of the cavity wall will extend the height for very
tall die up to 2mm thick. Contact: Mirror Semiconductor,
Inc., 17595 Harvard Ave., Suite 509, Irvine, CA 92614 % 866-404- 8800 E-mail:
info@MirrorSemi.com Web:
www.MirrorSemi.com or
www.TopLine.tv
See at IPC/APEX Booth #962. See at APEX, Booth 1046 3:31 PM
APEX 2014 Las Vegas Booth #1046
© 2014 Panasonic Corporation of North America. All rights reserved.
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116