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March, 2014 Tiny Liquid Flow


REFLOW SOLDERING SYSTEMS


CONDUCTION + CONVECTION HEAT


Reflow Soldering & Curing Applications include:


• BGA Reballing • BGA Packaging Falcon 5/C • Die/Heat Sink Bonding


• High Density Packaging/Substrates • Laminated Power Components


• Laser Diode Reflow • Lead Frames • Microwave Hybrids, Fluxless Au/Sn Reflow • Extremely Low O2 ppm Capability w/low N2 Consumption SIKAMA INTERNATIONAL, Inc. 118 E. Gutierrez Street • Santa Barbara, CA 93101-2314 U.S.A. Tel: 1-805-962-1000 • Fax: 1-805-962-6100 • sales@sikama.comwww.sikama.com Sensors from Sensirion


Staefa, Switzerland — Swiss sensor manufacturer Sensirion AG has launched its new liquid flow series LPP10 and LPG10 in an incredibly small size. The new technology is based on


planar microfluidic substrates, and the sensors are available with glass (LPG10) or a plastic (LPP10) packaging. Both ver- sions have a footprint of just 10 x 10mm. The new sensor’s glass


version is extremely durable, while the plastic version is more suitable for disposable applications and is very cost- effective in high volume. Both versions are suit-


able for various medical and biomed- ical applications. The sensors have no moving


parts and no obstacles in the flow path of the fluid. Innovative packag- ing enables Sensirion’s highly sensi- tive thermal flow sensor microchips to measure non-invasively through the wall of a flow channel inside a microfluidic planar substrate. This design provides unique sensitivity for liquid flow measurement and bubble detection in the range of 0 to 1000µl66/min. The sensors are particularly


suitable for monitoring flow rates and improving system performances in biomedical and life science appli- cations. Non-invasive flow sensing is possible due to the high sensitivi- ty achieved with CMOSens® Tech- nology.


A small digital CMOSens® mi-


crochip (2.2 x 3.5mm) is bonded to the microfluidic channel substrate. In addition to the sensor element, it houses the complete digital intelli- gence and the memory necessary for


Tiny liquid flow sensor.


signal linearization, temperature compensation and self-test algo- rithms. The chip provides a fully dig- ital I2C interface. Electrical contact is made by metallization above the microfluidic substrate. Fluidic ports below facilitate easy integration of discrete sensors into numerous de- signs.


The sensor has a short flow


sensing response time of 30ms, and sensor resolutions down to 0.5nl/min are feasible. A digital microsensor chip provides a fully calibrated digi- tal output, eliminating the need for


additional signal conditioning. Contact: Sensirion Inc., 2801


Townsgate Road, Suite 204, West-


lake Village, CA 91361 % 805-409-4900 fax: 805-435-0467 E-mail: info_us@sensirion.com Web: www.sensirion.com


Access expertise at every stage of the product cycle


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> planning > design > project management > customized service delivery


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products you take to market. Quality is a given. So is the kind of teamwork that puts you out front.We guarantee it.


Call and talk with us about your product development needs 507.345.5786 eimicro.com


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