March, 2014
www.us-tech.com
Page 105 Dow Corning Intros Dispensable Thermal Pads
Midland, MI — Dow Corning has introduced Dow Corning® Dispen sable Thermal Pads, an advanced new technology developed for more cost-effective thermal management of high-performance electron- ics targeting LED lamps and luminaires, data servers, telecommunications equipment and trans- portation applications. The new materials enable manufacturers to quickly and precisely print a layer of thermally conductive curable silicone compound in controllable thicknesses on complex-shaped sub- strates while ensuring excellent thermal manage- ment properties and reduced manufacturing cost. The dispensable thermal pads offer the
potential to reduce material costs by 30 to 60 per- cent by eliminating the waste more common to conventional fabricated thermal pads. They also enhance thermal performance and accelerate man- ufacturing cycles. The materials can be applied using standard screen or stencil print processes, or by using standard dispensing equip- ment. Either way, the material easi- ly conforms to complex and unevenly shaped substrates and will cure in place to help increase throughput and provide greater flexibility over
NTE Intros New Line of Cooling Fans
Bloomfield, NJ — NTE Electronics, Inc. has introduced a new line of high quality fans and accessories — needed to protect critical electronic compo- nents by keeping them at an optimal operating temperature. The new fans protect against thermal variances that could harm components and pre- vent a premature failure, while also ensuring optimal performance.
Discover Perfectly Clean: The Strongest VOC-Free Flux Remover
High performance materials deserve a precise level of cleaning. That’s why MicroCare features the newest innovative VOC-Exempt formula, VOC-Free Flux Remover -UltraClean™.
Equipment cooling fans. The cooling fans are offered in
both AC and DC types. AC fans pro- vide a constant flow, while DC fans can run at variable speeds. DC fans consume less power, generate lower levels of EM and RF Interference, and are much quieter in operation, making them suitable for personal computers and server applications. AC fans are designed to run on
100 to 125VAC, while the DC fans run on 12 and 24VDC. The fans are available in a variety of sizes: 40 x 40mm, 60 x 60mm, 80 x 80mm, 92 x 92mm, and 120 x 120mm. The low-noise, high-speed fans
have impellers and frames that are made of thermoplastic (DC types) and die-cast aluminum (AC types). They utilize ball bearings, have 11.8- in. (300mm) wire leads, and provide locked rotor protection. Operating life expectancy is 70,000 hours for DC fans, and 50,000 hours for AC types. All fans are RoHS-compliant and most are UL recognized. Metal Fan Guards are also
available for all NTE fan sizes. They are designed to keep airflow moving and debris out to ensure the longevi-
ty of the fan. Contact: NTE Electronics, Inc.,
44 Farrand Street, Bloomfield, NJ 07003 % 800-631-1250 or 973-748-5089 fax: 973-748-6224 Web:
www.nteinc.com
Discover Perfectly Clean. Call 1.800.638.0125 Email
TechSupport@MicroCare.com
See at APEX, Booth 938
Non-chlorinated, halogen-free cleaning fluid formulated to clean rosin fluxes, OA fluxes, synthetic fluxes, “no-clean” fluxes and solder pastes. Dispense with the Trigger Grip™ for faster, safer and more economical process of cleaning.
MicroCare provides the best technical cleaning fluid support. Every application ensures perfectly clean parts, every time.
deposited layer thickness. This new line encompasses four products, dis-
tinguished by varying levels of thermal conductivi- ty with or without controlled bond line thicknesses.
Dow Corning TC-4015 and TC-4016
Dispensable Thermal Pads offer thermal conduc- tivity of 1.5W/mK, and Dow Corning TC-4025 and TC-4026 Dispensable Thermal Pads offer higher 2.5W/mK thermal conductivity. Two grades, Dow Corning TC-4016 and TC-4026 Dispensable Thermal Pads, incorporate glass beads to offer improved control over bond line thickness. All products in the company’s new line bond
well with common electronics substrates like alu- minum and printed circuit boards. Plus, because they eliminate the fiberglass carrier used for con- ventional fabricated pads, Dow Corning’s solution offers lower thermal resistance, excellent compres- sion and consistently reliable, high-quality ther-
mal management over the lifetime of a product. Contact: Dow Corning Corporation, 2200 W.
Dispensable thermal pads.
Salzburg Rd., Midland, MI 48686-0994 % 989-496-4000 Web:
www.dowcorning.com
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