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www.us-tech.com
March, 2014 Viscom: New AOI Camera Module with 3D
Duluth, GA — Viscom is presenting what it calls the most advanced and comprehensive SPI, AOI and X-ray portfolio on the market including the latest building block in the compa- ny’s continual improvement of the 3D performance — the AOI high-per- formance camera module XM. To meet the latest as well as
future requirements in electronics manufacturing, not only must the inspection object as a whole be reli- ably detected, but each individual point of the object as well. This task is now solved in the XM module with the addition of a structured light pro- jector to the existing orthogonal and angular cameras, totaling over 60MPixels. With an image acquisi- tion rate of up to 1.8 gigapixels/sec- ond, the new XM module is extreme- ly fast, and fully upgradable for 3D. The existing S3088 platform,
with newly designed mechanics, and the addition of the 3D XM module, offers the fastest inspection speed with extraordinary defect detection capability.
Conformal coating inspection
XM high-performance AOI system.
(CCI) by the new Viscom S3088 Conformal Coating Inspection sys- tem inspects coatings quickly and reliably for typical defects such as cracks, bad spots, layers that are too thin or too thick, smearing, impuri- ties, or splashes. The CCI system uses an 8M camera module equipped with UV LEDs that reveal visible light emitted by UV fluorescent indi- cators contained in the transparent protective coating. The S3088 CCI system is available immediately. In SMT electronic assembly production, 3D SPI has established itself as the additional inspection point to com- plement optical or X-ray inspection. The key task is detecting unaccept- able paste deposits in terms of vol- ume, form, smearing and offset. In addition to providing defect detec- tion, the Viscom 3D SPI can accom-
plish much more. The SPI-AOI- Uplink function links paste inspec- tion and post-reflow inspection results for both easy and effective process control as well as improved
classification of AOI results. Contact: Viscom USA, 1775
Breckinridge Parkway, Suite 500, Duluth, GA 30096 % 678-966-9835 E-mail:
info@ViscomUSA.com Web:
www.ViscomUSA.com
See at IPC/APEX Booth #524.
Universal Fuzion
Maximizes Odd-Form Assembly
Conklin, NY — Universal Instru - ments is introducing the FuzionOF Platform, extending the company’s flagship Fuzion™ portfolio to address pre-and post-reflow odd- form assembly challenges. According to the company,
FuzionOF is the industry’s fastest and most versatile high-speed auto - mation platform, and complements the company’s Generation 88HT through-hole portfolio and Polaris Assembly Cell to form comprehen- sive odd-form automation solutions for any application or environment. Universal solutions are further dif- ferentiated by a broad knowledge base built on years of experience and
Fuzion: odd-form assembly specialist.
an expansive range of feeding solu- tions and nozzles, as well as custom design and implementation services. FuzionOF transforms back-end
assembly into a strategic advantage, offering a more economical, flexible and higher-performance solution than manual assembly or traditional cus- tom automation cells. By enabling a more efficient manufacturing model, FuzionOF drives down costs while maximizing yield and productivity. FuzionOF delivers highest avail -
able odd-form automation through put to shorten cycle times and eliminate bottlenecks. Its exceptional flexibility facilitates a fast and easy transition to new product challenges. These assets deliver higher utilization, predictable output, and consistent production rates to bring new products to market quicker.
Contact: Universal Instruments Corp., 33 Broome Corporate
Parkway, Conklin, NY 13748 % 607-779-5364 fax: 607-772-1878 E-mail:
zopff@uic.com Web:
www.uic.com
See at APEX, Booth 1963 See at IPC/APEX Booth #1125.
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