This page contains a Flash digital edition of a book.
March, 2014


www.us-tech.com


Page 107 Sonoscan: Imaging IGBT Power Modules


Elk Grove Village, IL — Sonoscan has shipped the first of its new D9600Z C-SAM® systems. This new model is designed expressly to facilitate the imag- ing of IGBT (Insulated Gate Bipolar Transistor) power modules. Power modules, such as IGBTs, are basically


high-speed high-power switches used in railway engines, electric automobiles, and many other appli- cations involving high power. Prior to packaging, the transistors themselves are at the top of the module and are too susceptible to water contact to permit acoustic imaging from above. Sonoscan has devel- oped a WaterPlume™ transducer that scans through the heat sink from the bottom of the mod- ule. Ultrasound pulsed into the heat sink will also image ceramic plates (rafts) above the heat sink, and even the die attachments near the top of the module. To speed imaging, the D9600Z has an option for


two transducers that operate simultaneously. Each transducer is coupled with the surface of the heat


2


Heidenhain Intros ETEL High-Force Iron-Core Linear Motor


Schaumburg, IL — ETEL has intro- duced the latest in linear motor tech- nology, the LMS ironcore linear motor series.


Incorporating a patented anti-


cogging design, these linear motors offer a significant advantage for ther- mal-drift-sensitive precision mach - ines, and are an excellent solution for many demanding motion control applications. With this introduction, ETEL broadens its already sizable linear


sink by a constant stream of upward-flowing water that touches only the heat sink. Air knives built into the system dry the heat sink after scanning. The stage of the D9600Z is supplied with var-


ious plates designed to hold common IGBT module configurations. The operation is fully automated; the operator places the module on the stage, closes the door, and pushes a button. The targets of interest include voids in the


solder above the heat sink, the flatness of ceramic plates, and voids in the die attach material. The system can also measure and map the thickness of the solder layer during scanning. The D9600Z is a quick, nondestructive tool to analyze IGBT power modules, which are typically


costly and destined for critical applications. Contact: Sonoscan, Inc., 2149 E. Pratt Blvd.,


Testing heat-sink performance with water plume.


12/5/13 9:16 AM Page 2


Elk Grove Village, IL 60007 % 847-437-6400 fax: 847-437-1550 E-mail: info@sonoscan.com Web: www.sonoscan.com


It’s time to High-force linear motor.


motor offering, simultaneously pro- viding a product with substantially higher continuous force than its existing LMG linear motor series. And since the mechanical integration is similar with both series, easy upgrades are now possible. The extension of ETEL’s iron-


core linear motor range opens new application potential in many differ- ent markets, from high-end automa- tion to demanding semiconductor / electronic motion systems. The LMS series can be used in any machines where a high power density is required together with a high dynam- ic for mid-range moving masses. Because of the anti-cogging


design, the new LMS linear motors enable an exceptional peak force den- sity in the magnetic gap, as well as unparalleled thermal efficiency, again important for thermal-drift-


sensitive machines. Contact: Heidenhain Corp., 333


E. State Parkway, Schaumburg, IL 60173 % 847-490-1101 or 877-565- 9151 fax: 847-490-3031 E-mail: kstoneski@heidenhain.com Web: www.heidenhain.us or etelusa.com


 


 


Network with the world's top manufacturers, distributors and sales representatives at EDS 2014. Register today at edsconnects.com.


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100  |  Page 101  |  Page 102  |  Page 103  |  Page 104  |  Page 105  |  Page 106  |  Page 107  |  Page 108  |  Page 109  |  Page 110  |  Page 111  |  Page 112  |  Page 113  |  Page 114  |  Page 115  |  Page 116