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hi-TeCh evenTS www.us-tech.com


At IPC APEX: Keynotes and Soldering Contest in Las Vegas


Bannockburn, IL — IPC has collected several top-drawer, inspirational keynote speakers to kick off this year’s APEX Expo at the Mandalay Bay Hotel in Las Vegas. On opening day, Tuesday, March


25, at 8:30 a.m., dynamic inspirational speaker and tech entrepreneur, Dr. Peter Diamandis, M.D., Chairman/ CEO, X PRIZE Founda tion and Chair - man/Co-Founder, Singular ity Univer - sity, will share his insights into how breakthroughs in exponentially grow- ing technologies like artificial intelli- gence, nanomaterials, 3-D printing, robotics and digital medicine will re- engineer products, companies, indus- tries, and even society, over the next


20 years. He will explain how human society has evolved from “local and lin- ear” to “global and exponential,” and how this change has not only spawned the creation of new billion dollar start- ups out of nowhere, but also led to the demise of 50-year-old billion dollar companies overnight. Through his work as Chairman


and Co-Founder of Singularity Univ - ersity and Chairman/CEO of X PRIZE, Diamandis has proven the transformational power that exponen- tially growing technology has on com- panies, governments and human ity, and on “do-it-yourself” technologists and small companies who can now achieve what only governments or


IEEE Globecom 2014 in Austin, Call for Papers


New York, NY —IEEE Globecom 2014 (www.ieee-globecom.org/2014), the premier international event dedicated to driving innovations and technologi- cal breakthroughs in nearly every telecommunications field, has an - nounced April 1 as the “Call for Papers” deadline for original Industry Forums & Exhibition (IF&E) and technical symposium presentations. To be held December 8-12 in Austin, Texas at the Hilton Austin. The five-day flagship event of the


IEEE Communications Society will host more than 1,500 attendees with keynotes, panels, tutorials workshops and symposia detailing key areas in telecommunications ranging from next generation broadband, wireless, multimedia, image and voice advance-


ments to e-Health, Internet of Things (IoT), game theory, power-line, satel- lite, space, green and social network- ing communications. “IEEE Globecom provides a pro-


found opportunity for international scientists, government and industry professionals and academia to share their visions and ideas for a better future,” says Professor Theodore (Ted) S. Rappaport of New York University. Rappaport is part of the team that is bringing the IEEE Globecom 2014 conference to Austin for the first time. Contact: IEEE Communications


Society, Heather Ann Sweeney % 212-705-8938


E-mail: h.sweeney@comsoc.org Web: www.ieee-globecom.org/2014


2014 ISSUE Jan/Feb March April/May EDITORIAL


Test & Measurement Electronics West/MDM PP


Production & Packaging APEX PP


SMT & Production SMT/Hybrid/PKG PP Nepcon China PP EDS PP


SHOW DesignCon Electronics West/MDM


APEC APEX


Electronics New England


Nepcon China Del Mar Electronics SMT/Hybrid/PKG EDS


MFG4


June July


August


Components & Distribution Test & Assembly


Semicon West/Intersolar PP


Production & Packaging Nepcon South China PP


September PCB & Test PCB West PP SMTAI PP ATX PP IMAPS PP


October


Components & Distribution Electronica PP SMTAI PP


Nov/Dec


Test & Measurement Electronics West/MDM PP


PP= Product Preview Nepcon South China


Autotestcon PCB West PP SMTAI


ATX Midwest IMAPS


The Assembly MDM Minneapolis Fabtech Electronica


Electronics West/MDM 8/26 - 8/28


9/16 - 9/18 9/24 - 9/26 9/29 - 10/1 10/1 - 10/2 10/14 - 10/16


10/27 - 10/29 10/29 - 10/30 11/4 - 11/6 11/11 - 11/14 2/10 - 2/12


Shenzhen, China


St. Louis, MO Santa Clara, CA Rosemont, IL Chicago, IL San Diego, CA


Rosemont, IL Minneapolis, MN Atlanta, GA


Munich Germany Anaheim, CA


Eastec


Wire Processing Tech IMS


Atlantic Design Semicon West/Intersolar


EDITOrIAL CALENDAr DATE


LOCATION


1/28 - 1/29 2/11 - 2/13


3/18 - 3/20 3/25 - 3/27 3/26 - 3/27


4/22 - 4/24 5/6 - 5/7 5/6 - 5/8 5/6 - 5/8 5/13 - 5/15 5/14 - 5/15 6/2 - 6/5


5/6 - 5/8


6/10 - 6/12 7/8 - 7/10


Santa Clara, CA Anaheim, CA


Ft. Worth, TX Las Vegas, NV Boston, MA


Shanghai, China San Diego, CA


Nuremberg, Germany Las Vegas, NV 


Hartford, CT   


Milwaukee, WI Tampa Bay, FL New York, NY


San Francisco, CA


large corporations could do before. Swarm robotics They will flock. They will


swarm. And they will tackle the dan- gerous, dirty and dull jobs for which humans are inherently ill-suited. They’re multirobot systems, and one day they will become the norm, according to roboticist and inventor James McLurkin. “Swarm Robotics and the Toys, Movies and Insects That Made It All Possible” is the keynote topic being delivered by speaker James McLurkin, Roboticist, Inventor, Researcher and Teacher on Wednesday, March 26, at 9:00 a.m. Inspired by the complex group


behaviors found in ants, bees, wasps and termites, McLurkin’s work focus- es on developing software and pro- gramming techniques for groups of autonomous robots with populations


ranging from 10 to 10,000. Armed with degrees in electrical


engineering and computer science from M.I.T. and University of California — Berkeley, McLurkin con- tinues to harness his inventiveness to develop the robot swarms that will one day perform jobs ranging from warehouse operations to search-and- rescue missions to Mars exploration. Don’t miss this fascinating look at the future of robotics, and the technology that is making it happen.


The Physics of NASCAr On Thursday, March 27 9:00


a.m., Diandra Leslie-Pelecky, Ph.D., Physicist, Researcher and Author talks about how to design and manu- facture a car that will move at speeds in lthe neighborhood of 200 mph (321 km/h), yet handle with precision and,


Continued on next page


Trade Show Calendar MORE SHOWS: www.topline.tv/tradeshows.cfm


Mar. 25-27, 2014, IPC APEX Expo. *Mandalay Bay Resort & Convention Center, Las Vegas, NV Contact: IPC % 877-472-4724 or 847-597-2860 (outside U.S. & Canada) Web: www.ipc.org


Mar. 26-27, 2014, Southeast Design-2-Part Show. *Cobb Galleria Centre, Atlanta, GA Contact: Design-2-Part Shows, P.O. Box 7193, Prospect, CT 06712 % 203-758-6663 Web: www.d2p.com


Mar. 26-27, 2014, Electronics New England. *Boston Convention Center, Boston, MA. Contact: UBM Canon 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web: www.canontradeshows.com


Apr. 1-2, Printed Electronics Europe 2014. *Estrel Berlin, Berlin, Germany. Contact: Web: www.idtechex.com


Apr. 9-10, Greater New York Design-2-Part Show. *Meadowlands Exposition Center,


Secaucus, NJ. Contact: Design-2-Part Shows, P.O. Box 7193, Prospect, CT 06712 % 203-758-6663 Web: www.d2p.com


Apr. 22-24, NEPCON China. *Shanghai World Convention & Exhibition Centre, Shanghai, China. Contact: Reed Exhibitions China, Unit 4-5, 12/F, Office Tower E1, The Towers Oriental Plaza, No.1, East Chang An Avenue, Dong Cheng District, Beijing 100738, P.R.China % +86-10-8518 9070 fax: +86-10-8518 9060 E-mail: enquiry@reedexpo.com.cn Web: www.reedexpo.com.cn


May 6-8, 2014, SMT/Hybrid Packaging *Nuremberg Exhibition Center, Nuremberg, Germany. Contact: Mesago Messe Frankfurt GmbH E-mail: wagloehner@mesago.de Web: www.mesago.de/en/SMT


May 6-8, EDS. *The Cosmopolitan Hotel, Las Vegas, NV. Contact: EDS, 222 South Riverside Plaza, Suite 2160, Chicago, IL 60606 % 312-648-1140 fax: 312-648-4282 E-mail: eds@edsc.org Web: www.edsc.org


May 6-8, MGF4. *Connecticut Convention Center, Hartford, CT. Contact: SME, One SME Drive, Dearborn, MI 48121 % 800-733-4763 or 313-271-1500 fax: 313-271-2861 Web: www.mfg4event.com


May 14-15, Electrical Wire Processing Technology Expo. *Wisconsin Center, Milwaukee, WI. Contact: Expo Productions % 262-367-5500 Web: www.epishows.com


June 2-5, IMS, International Microwave Symposium. *Tampa Bay, FL. Contact: www.mtt.org


June 3-6, Automatica 2014. * New Munich Trade Fair Centre, Munich, Germany. Contact: Munich Trade Fairs, 75 Broad St., 21 Floor, New York, NY 10004 % 646-437-1014 Web: www.munichtradefairs.com or www.automatica-munich.com


Sept. 17-18, Greater Ohio Design-2-Part Show. * John S. Knight Center, Akron, OH. Contact: Design-2-Part Shows, P.O. Box 7193, Prospect, CT 06712 % 203-758-6663 Web: www.d2p.com


Nov. 11-14, electronica. *New Munich Trade Fair Centre, Munich, Germany. Contact: Munich Trade Fairs, 75 Broad St., 21 Floor, New York, NY 10004 % 646-437-1014 Web: www.munichtradefairs.com


Dec. 8-12, IEEE Globecom 2014.* Hilton Austin, Austin, TX. Contact: IEEE Communications Society, Heather Ann Sweeney % 212-705-8938 E-mail: h.sweeney@comsoc.org Web: www.ieee-globecom.org/2014


March, 2014


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