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www.us-tech.com
March, 2014 What’s Inside That USB Drive? By Martin Oppermann, Technische Universität Dresden, Center of Microtechnical Manufacturing (ZmP), Germany,
E-mail:
oppermann@zmp.et.tu-dresden.de; Holger Roth, GE Measurement & Control / phoenix|x-ray, Stuttgart and Wunstorf, Germany; Tobias Neubrand, GE Measurement & Control / phoenix|x-ray, Stuttgart and Wunstorf, Germany; and Thomas Zerna, Technische Universität Dresden, Center of Microtechnical Manufacturing (ZmP), Germany
arably connected with miniaturization in packag- ing and the needs for nondestructive testing (NDT) methods. Such testing approaches support efforts to maintain high quality assurance (QA) and relia- bility for these miniature electronic products and microsystems. By using two generations of conven- tional universal-serial-bus (USB) memory drives with stacked dies, the evolution and limitations of high-resolution NDT methods for electronic pack- aging were evaluated, including methods such as x-ray diagnostics and x-ray nano computed tomog- raphy (nanoCT). By applying NDT x-ray analysis methods, it was possible to look inside several dif- ferent USB memory devices for investigations revealing, for example, connections using gold bond wires on a silicon die with copper metalliza- tion. Such studies were possible with no harm to the circuitry or the internal device.
E
NDT Methods Smaller and more densely configured elec-
tronic packaging technologies require enhanced high-resolution NDT methods for safe analysis and investigation. The most useful testing methods are those capable of imaging nanoscale packaging defects. Evaluating the limitations of different NDT methods can be done through the use of so- called reference test objects and defect samples. Another way to assess the effectiveness of an NDT method involves the use of electronic systems with a limited volume and complexity like a USB mem- ory device, to show how well a given NDT method can examine the internal contents of that device. As one of these test cases for evaluating NDT methods, a micro-USB memory device with 2GB
This is a 3D overview visualization of the scanned 32GB USB memory device with virtually removed housing.
package (SiP) configuration, housed in a metal cage with a polymer cover. Both x-ray radiography and x-ray CT test approaches (GE 180kV Phoenix Nanomex and Nanotom x-ray systems) were used to investigate the components inside the USB memory devices, with varying degrees of success. The x-ray radiography showed the components
lectronic products and microsystems tech- nology can be characterized by a trend of continuing miniaturization. They are insep-
memory was used as part of investigations per- formed at the Dresden University of Technology (Dresden, Germany). The electronic circuitry with- in the memory device was designed as a system-in-
inside the memory device, but limited three- dimensional (3D) views of those components — using GE 180kV Phoenix Nanomex and Nanotom x-ray systems. Within the USB memory device, its printed-
circuit board (PCB), some passive components (such as capacitors and resistors), the bond wires (comprised of gold material) for the controller die and memory devices, the crystal oscillator, and the activity-reporting light-emitting diode (LED) were all visible using x-ray radiography. However, the x-ray CT test approach revealed more information about the inside structure of the memory device and the location of additional components, show- ing the bonding area of four stacked memory die. For the particular USB memory device used for this experiment, the use of four stacked memory die represented state-of-the-art electronic packag- ing in 2008 when the memory device was pro- duced, for a relatively inexpensive product at the time — approximately $23 USD in 2008.
Evaluating USB Memory A discussion between colleagues at the
Dresden University of Technology and at GE Measurement & Control (
www.ge-mcs.com) stirred an idea to compare NDT analyses of different USB memory devices, such as the previous device from 2008 and a newer USB memory device from 2012. Questions to be answered as part of this investiga-
tion included: l
the more recent memory devices? l
valid for this market? l
What technologies have been used to produce Are the statements of technology roadmaps
What details are visible for each USB memory device when applying the newest NDT x-ray inspection technologies?
Continued on next page
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