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February, 2020 ITW Debuts Next-Gen Momentum II Printer
Minneapolis, MN — ITW EAE is in- troducing the MPM®Momentum II™ Printer as the next generation of the highly successful Momentum printer line. The Momentum II includes a new set of enhanced technologies that bring further advancement in quality, yield, productivity, ease of use, and flexibility. The Momentum II has a newly
designed cover set with a larger win- dow and wider access inside the printer. The quick-release squeegee makes changing blades quick and easy with no tools required. It takes less than 30 seconds to change the blade. A new patent-pending jar dis-
penser is available in addition to the standard cartridge dispenser. The operating software has been upgrad- ed to Windows 10 and has new pro- duction tools and QuickStart™ pro- gramming that make it even more powerful and easier to use. One of the key new features
available for the Momentum II is a new paste management system that provides innovative tools to improve yield and enable Industry 4.0 trace- ability. The system includes an indus- try-first paste temperature monitor, measured for proper paste viscosity and a roll height monitor that now measures both upper and lower lim-
its. All data can be recorded for board traceability. This system will improve yield and reduce waste by ensuring proper paste viscosity to avoid bridg- ing and voiding and eliminate insuffi- cient or excess paste volumes. Momentum II includes new
EdgeLoc II™ board clamping that uses a side-snugging system to re- move the need for top clamps that in- terfere with the PCB to stencil con- tact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. With EdgeLoc II, robust flippers engage to secure the board across the top edge, ensuring board flatness then move out of the
way once the board is firmly gripped from the side. EdgeLoc+ board clamping is also available and can change between edge and top clamp-
ing simply through software. Contact: ITW EAE, a division of
Illinois Tool Works, 8860 207th Street West, Minneapolis, MN 55044 % 952-469-8278 E-mail:
roger.dullinger@itweae.com Web:
www.itweae.com
See at IPC APEX, Booth 813
CyberOptics Demonstrates Multifunction AOI, SPI, and CMM System
Minneapolis, MN — CyberOptics® Corporation is showcasing its SQ3000™ multifunctional system for AOI, SPI and CMM. In addition, CyberOptics will demonstrate the latest 3D AOI software with ultra- fast programming capabilities, auto- tuning and enhancements that sig- nificantly speed set up, simplify the process, reduce training efforts, and minimize operator interaction. The 3D SQ3000 all-in-one sys-
tem can identify critical defects and measure critical parameters, provid-
CyberOptics’ inspection system offers AOI, SPI and coordinate measurement in a single platform.
Get insider information
Turn inspection data into better products with
SIGMA Link process improvement software. Get the data and images you need to improve yield, diagnose your PCB process, and continuously improve your products. SIGMA Link is your award-winning real-time web-based interface for unifi ed SPI and AOI data, allowing you to connect multiple machines to your manufacturing execution system. Thanks to rapid data correlation and analysis, it delivers powerful possibilities for measuring, controlling and anticipating process variations – long before they aff ect your end product. It’s one more part of Mycronic 4.0, and one step closer to perfection.
ing excellent process control solution for effective yield management. In addition to AOI and SPI applica- tions, highly accurate coordinate measurements can be obtained faster than a traditional coordinate measurement machine (CMM) — in seconds, not hours. The world’s first inline CMM includes an extensive software suite for metrology-grade measurements on all critical points. Powered by proprietary multi-
reflection suppression (MRS) sensor technology, the 3D SQ3000 all-in- one system offers a combination of speed, resolution and accuracy. The MRS sensor meticulously identifies and rejects reflections caused by shiny components, making it an ideal technology solution for a wide range of applications with stringent requirements. The ultra-high resolu- tion MRS sensor option delivers su- perior performance suitable for sock- et metrology, microelectronics and other applications where an even greater degree of accuracy and in-
spection reliability is critical. Contact: CyberOptics, Corp.,
5900 Golden Hills Drive, Minneapo- lis, MN 55416 % 952-820-5837 E-mail:
cfuranna@cyberoptics.com Web:
www.cyberoptics.com
See at IPC APEX, Booth 3113 See at IPC APEX, Booth 1336
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