February, 2020
www.us-
tech.com
The Importance of User Objectivity in Process Control Continued from previous page
been set, it can be reproduced with the same results every time, regard- less of operator skill. Solder paste can be ready for
production from refrigerator to line in about 10 minutes. To verify that the paste is at optimal viscosity and temperature, a Malcom viscometer can be used by the paste manufactur- ers to measure paste viscosity. Meas- uring these readings before produc- tion allows for an actual objective reading to be recorded as proof and to provide traceability. Spot checking the solder paste
from time to time during production also adds an extra degree of verifica- tion to the process. This ensures that the paste is still within the recom- mended viscosity range as the pro- duction cycle progresses and also calls for more paste. The longer sol- der paste sits on the stencil, the more the properties of the paste change. This process is a great way of
confirming that the solder viscosity is not the problem. This also elimi- nates inconsistencies that arise due to operator variability. These read- ings can be recorded so that objective data is gathered to trace the paste conditions at any given point in the production cycle.
CheckSum: Parallel Functional Test for Small Boards
Arlington, WA — CheckSum is show- casing its new parallel functional test at IPC APEX 2020. Small boards create numerous problems for elec- tronics manufacturers, because of the mismatch between production throughput and test throughput. This mismatch has been ad-
dressed by manufacturers in three ways: slowing production, batch pro- cessing with WIP inventory buildup, and by adding test capacity to match production throughput. Each of these approaches comes with costs and side effects for manufacturers. An increase in panel density is
driving substantial efficiency and throughput gains on SMT lines, how- ever, typical testing processes are unable to match this increased throughput. A new kind of test technology
uses simultaneous functional testing of the entire panel of small boards. Parallel test provides benefits to manufacturers by matching SMT line throughput. The major benefits of this new technology include: en- abling inline test to eliminate human handling; providing real-time data to intelligent digital systems; and elim- inating the need for WIP inventory, reducing rework issues, increasing throughput and efficiency, and sim- plifying the process by eliminating test cell operations. Contact: CheckSum, LLC, 6120
195th Street N.E., Arlington, WA 98223 % 360-435-5510 E-mail:
lisa.jones@
checksum.com Web:
www.checksum.com
See at IPC APEX, Booth 3445
Other Factors to Control Of course, solder paste viscosity
is only one factor that can contribute to errors within the manufacturing process. Reducing operator variables by automating processes, as well as verifying a process by measuring and collecting data goes a long way in im- proving process control. If errors are found at a higher
rate during a specific production run, those boards can be cross-referenced to data to verify the specific process was within spec or not. We can set up the same sort of process to reduce er- rors caused by other factors, such as bare PCB cleaning, PCB, part or reel
humidity, reflow oven conditions, and stencil cleaning.
Page 37
Seika Machinery offers many
different tools and equipment to help with process control. Examples of some of these tools are Malcom vis- cometers, paste mixers, wetting testers, reflow oven profilers, McDry low-humidity storage, Unitech PCB cleaners, and Sawa ultrasonic stencil cleaners. Seika offers a wide variety of equipment to improve the entire production and testing process. Contact: Seika Machinery, Inc.,
Malcom SPS-2000 solder paste mixer.
26218 Industrial Boulevard, Hay- ward, CA 94545 % 510-293-0580 E-mail:
info@seikausa.com Web:
www.seikausa.com r
See at IPC APEX, Booth 3645
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