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Las Vegas, NV — One of the greatest challenges in programming AOI sys- tems is the detection of all non-con- forming placements, especially those
www.us-
tech.com
related to solder joints —without cre- ating a long list of false calls. The in- dustry had to accept that the more accurately one wishes to measure,
the more false judgments a system will make. This commonly results in long debugging time and complex programming. MEK’s full 3D ISO-Spector M1A
delivers a self-learning algorithm for solder joint inspection that will detect any deviation outside the expected standard appearance of a solder joint. A proprietary solution with artificial intelligence (AI) is continuously and centrally monitoring production and adjusting hundreds of tolerance val- ues where needed to maximize detec- tion and minimize false calls. The programmer does not need
to identify the specific inspection lo- cations, light settings or acceptance criteria. This not only reduces pro- gramming time, but also removes the often-unpredictable human variable, ensuring that the inspection results are more reliable. Also available is the desktop
SmartDetect for the MultiStrip 9480
Highly Innovative Quality Monitoring Option
The MultiStrip 9480 cut and strip machine is now being offered with SmartDetect for advanced quality monitoring. The sensor- controlled system monitors the complete stripping process in real time and detects any contact between the stripping blades and the conductor, improving production quality
The wide monitoring range allows the processing of discrete wire as well as coaxial and multiconductor cables
Continuously performs a self-test
MultiStrip 9480 machines
The S.ON software allows individual tolerance adjustments for each processing layer of the programmed wires
schleuniger.com IPC APEX EXPO
Booth 3213 Wire Solutions for a Connected World
PowerSpector GTAz, designed for max- imum defect coverage, while maintain- ing short programming times. It can be equipped with nine cameras: one on the top and eight on the sides. The company is also offering its
SpectorBOX AOI system, which is designed to accommodate solder frames on return or feed conveyors. The system offers bottom-side, top- side, simultaneous dual-side inspec- tion, or conformal coating inspection, deploying up to 18 cameras, z-axis positioning and autofocus. SpectorBOX GTAz bottom-up
AOI is optimized for the inspection of through-hole solder joints to identify defects, such as presence/absence of
February, 2020 MEK Highlights Latest Lineup of AOI Technology
solder, wetting problems, meniscus shape, pin insertion problems, and bridging, with automated nine-image microscopic presentation for classifi- cation and repair. SpectorBOX JUz CCI is a solu-
tion for conformal coating inspection. It can be used after manual spray, automatic spray and dip coating ap- plications. The system is able to pro-
ISO-Spector M1A AOI system (top), PowerSpector GTAz
(bottom left) and SpectorBOX AOI system (bottom right).
vide coating defect detection, cover- ing the components and around the components. Bubbles and other con- tamination can be detected. MEK’s Nutek main frame allows easy inte- gration of one or two SpectorBOX
modular AOI systems. Contact: MEK Americas, LLC, 8275 S. Eastern Avenue, Suite 200,
Las Vegas, NV 89123 % 702-550-7566 E-mail:
info@marantz-electronics.com Web:
www.marantz-electronics.com
See at IPC APEX, Booth 3029
Ultra-Thin Lead Frames for RFID Devices from Heraeus
West Conshohocken, PA — Heraeus Electronics has launched a new ultra-thin lead frame for RFID sys- tems, the XOB10. RFID technologies are used for contactless payment and in ID documents. To increase the security of these
See at IPC APEX, Booth 3213
documents, manufacturers integrate additional layers in the security ID
cards and data pages of documents. These include holograms and foils. In order to include these increasing number of security layers in docu- ments, card manufacturers need ex- tremely thin modules. The thinner the lead frame in the module, the more secure the final product. Heraeus’ new lead frame is
about half the thickness of a sheet of paper, or 35 µm. As the sole company in the market, Heraeus offers a wide range of products to further increase the security of ID, credit and access
XOB10 ultra-thin lead frame for security cards.
cards. This includes bonding wires and non-conductive adhesives for module packaging. In its application centers in the
U.S., Europe and Asia, Heraeus can test technologies and tailor applica-
tions to specific customer needs. Contact: Heraeus, Inc., 24 Union
Hill Road, West Conshohocken, PA 19428 % 215-944-9981 E-mail:
jeffery.oddo@heraeus.com Web:
www.heraeus-electronics.com
See at IPC APEX, Booth 1806, and ATX/MD&M West, Booth 2101
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