Page 14


Business news www.us- tech.com February, 2020


MIRTEC Collaborates with Universal Instruments’ Advanced Process Lab


Oxford, CT — MIRTEC has installed one of its award-winning MV-6 OM- NI 3D AOI systems at Universal In- struments Corporation’s (UIC) ad- vanced process lab (APL) in Conklin, New York. Universal’s APL offers comprehensive research and ad- vanced assembly services that enable manufacturers to realize rapid prod- uct introduction, maximize yield and optimize reliability.


process knowledge of UIC personnel.” MIRTEC’s MV-6 OMNI 3D AOI


machines are configured with the com- pany’s exclusive OMNI-VISION® 3D inspection system, which combines a 15 MP CoaXPress camera with MIRTEC’s digital tri-frequency moiré 3D system. This proprietary system yields height measurements that are used to detect lifted component and lifted lead defects, as well as 3D solder fillet inspection post-reflow. Fully configured, the


MV-6 OMNI systems in- clude four 10 MP side-view cameras plus the 15 MP top- down camera, as well as an eight-phase color lighting system to provide precision inspection of SMT devices on finished assemblies. UIC is a global lead er


Brian D’Amico, president of MIRTEC (left), and David Vicari, director of


Universal Instruments’ APL (right). Brian D’Amico, president of


MIRTEC’s North American sales and service division, says, “We are very ex- cited to partner with Universal Instru- ments in placing one of our technolog- ically advanced 3D AOI systems in their advanced process lab. Our inten- tion is to collaborate on new inspection solutions for the electronics manufac- turing industry, combining the strengths of MIRTEC’s 3D inspection technology with the expertise and


in the design and manufac- ture of advanced automation and assembly equipment so- lutions for electronics manu- facturing. UIC delivers com- prehensive solutions to a global customer base by leveraging exclusive pro cess expertise, combined with its


innovative portfolio of flexible plat- forms for surface mount, insertion mount, advanced semiconductor pack- aging, and end-of-line automation. The company’s headquarters are in Conklin, New York, with offices in Eu-


rope, Asia and the Americas. Contact: MIRTEC Corp., 3


Morse Road, Oxford, CT 06478 % 203-881-5559 fax: 203-881-3322 E-mail: bdamico@mindspring.com Web: www.mirtec.com r


Siemens and Qualcomm Develop 5G Network


Washington, D.C. — Siemens and Qualcomm Technologies have imple- mented the first private 5G stand- alone network in a real industrial en- vironment using the 3.7 to 3.8 GHz band. Siemens is providing the actual


industrial test conditions and end de- vices, such as Simatic control sys- tems and IO devices, and Qualcomm is supplying the 5G test network and the relevant test equipment. The 5G network was installed


in Siemens’ automotive showroom and test center in Nuremberg. Auto- mated guided vehicles (AGVs) are displayed there, as well as new man- ufacturing options and methods be- fore they are put into action at cus- tomer sites. The automotive showroom and


test center enables Siemens and Qual- comm to test all the different technolo- gies in a standalone 5G network under actual operating conditions.


Rohde and Schwarz Demos 300 GHz Wireless Communication


Columbia, MD —While 5G technology is at the first stages of rollout, Rohde & Schwarz, the Fraunhofer Institute for Telecommunications — Heinrich Hertz Institute (HHI), and the Fraun- hofer Institute for Applied Solid State Physics (IAF) are taking a step fur- ther with demonstrations in the tera- hertz frequency band. The col- laboration has resulted in a wireless transmit and receive system operating between 270 and 320 GHz, with further frequency extensions for po- tential 6G bands already in preparation. Research into 6G is al-


ready underway in industry and academia. While 5G in- troduces mmWave frequen- cies with wider bandwidths for higher data rates and en- ables new applications, such as wireless factory automa- tion (industrial IoT) and for autonomous vehicles, the aim of 6G is to push the boundaries of trans- mission bandwidths even higher. Although it is not yet clear which


transmitter and receiver. Involved in the current collabo-


ration are the Fraunhofer HHI and Fraunhofer IAF. The HHI works on signal processing, synchronization be- tween transmitter and receiver, and system integration. The IAF con- tributes with high-performance mil-


300 GHz signal generation system.


limeter-wave transmitter and receiv- er modules. The joint research targets fre-


technologies 6G will enable, it is al- ready apparent that frequency band- widths need to be further increased to enable terabit-class data rates. Wide contiguous frequency blocks can only be found at sub-THz and THz bands — the frequency range above 100 GHz. The utilization of THz frequencies for 6G is estimated to become commercial in the next 8 to 10 years. But, Rohde & Schwarz has al-


Qualcomm Technologies in-


stalled the 5G test system compris- ing infrastructure and end devices in less than three weeks. Siemens pro- vided the actual industrial set up. “Industrial 5G is the gateway to an all-encompassing, wireless network for production, maintenance and lo- gistics. High data rates, ultra-reli- able transmission and extremely low latencies will allow significant in- creases in efficiency and flexibility in industrial added value,” says Eckard Eberle, CEO — process automation at Siemens. “We are extremely pleased to have this collaboration with Qualcomm Technologies, so that we can drive forward the devel- opment and technical implementa- tion of private 5G networks in the in-


dustrial sector.” Contact: Siemens AG, 300 New


Jersey Avenue, Suite 1000, Wash- ington, D.C., 20001 % 800-743-6367 Web: www.new.siemens.com r


ready presented a demonstration set up for 300 GHz. The system was also displayed at EuMW2019 in Paris as part of a workshop on mmWave and THz wireless communication, where it consisted of 300 GHz transceiver frontends, the R&S SMW200A vector signal generator and R&S FSW43 signal and spectrum analyzer, as well as units for synchronization of


quencies above 100 GHz, where the primary focus is on the D-band (150 GHz) and the H-band (300 GHz). Carrier frequencies above 300


GHz are still the subject of fundamen- tal research. A first demonstrator re- sulting from the research collabora- tion is a system allowing signal gener- ation and signal analysis at 300 GHz with 2 GHz bandwidth. The signal can be arbitrary modulated for conducting transmission experiments with be- yond-5G candidate waveforms, which are appropriate for THz communica- tion or for performing channel propa-


gation measurements. Contact: Rohde & Schwarz USA,


Inc., 6821 Benjamin Franklin Drive, Columbia, MD 21046 % 888-837-8772 E-mail: tomas.berghall@rsa.rohde-schwarz.com Web: www.rohde-schwarz.com r


Chandler, Arizona Tyler, TX — SPEA has opened a new office in Chandler, Arizona, within the metropolitan area of Phoenix. The re- cently opened office is fully equipped to provide quick technical assistance to SPEA customers in the region. “SPEA has had a large customer


base in Arizona and southern Califor- nia for many years. Due to the compa- ny’s rapidly growing system installa- tions, especially in the semiconductor industry, we found it proactive to es- tablish a local office to support these customers,” says David Buhrkuhl, president of SPEA America. Besides the offices for the local


engineering team, the office will allow for local spare parts storage, meeting


SPEA Opens New Office in


rooms and administrative staff. “After our customers’ adoption


of SPEA C600 and DOT mixed-signal test systems for medical and automo- tive devices, we saw the benefit of having a local office. In addition, cus- tomers have recently installed H3580 MEMS sensor pick-and-place test handlers to provide technical as- sistance to these systems for any op- erational need,” says Luca Fanelli, semiconductor business development


manager, SPEA. Contact: SPEA America, LLC,


2609 SSW Loop 323, Tyler, TX 75701 % 903-595-4433 fax: 903-595- 5003 E-mail: info.america@spea.com Web: www.spea.com


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100  |  Page 101  |  Page 102  |  Page 103  |  Page 104  |  Page 105  |  Page 106  |  Page 107  |  Page 108  |  Page 109  |  Page 110  |  Page 111  |  Page 112  |  Page 113  |  Page 114  |  Page 115  |  Page 116  |  Page 117  |  Page 118  |  Page 119  |  Page 120  |  Page 121  |  Page 122  |  Page 123  |  Page 124  |  Page 125  |  Page 126  |  Page 127  |  Page 128  |  Page 129  |  Page 130  |  Page 131  |  Page 132  |  Page 133  |  Page 134  |  Page 135  |  Page 136  |  Page 137  |  Page 138  |  Page 139  |  Page 140  |  Page 141  |  Page 142  |  Page 143  |  Page 144