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February, 2020
Vi TECHNOLOGY: Machine Learning Software for Reliable Inspection
Rowley, MA — Vi TECHNOLOGY’s inspection equipment is designed to use machine learning in order to sig- nificantly increase process reliability by eliminating potential errors and to free operators from to focus on the manufacturing process. Machine learning is a field of
artificial intelligence (AI) that allows a computer-controlled software or sys- tem to make decisions and to learn
detect or reconstruct by itself is requested from the operator. To optimize solder paste detec-
tion, the lighting level is automati- cally adjusted according to the color of the PCB, whether white or black. In addition, the color, shape and position of the screen printing are also learned during programming. The machine is also able to learn how to recognize glue dots when scanning the first PCB and automatical- ly optimizes its internal para - meters. The same applies to the
recognition of skip marks. The system learns to identify them during the first inspection, regardless of the shape of the sticker of marker trace on sub- sequent boards. The precise stop position
of the board conveyor, regard- less of the geometry or position of the board on the conveyor, is calculated in real time, with- out any operator-managed learning required. Vi TECHNOLOGY’s R&D
PI series 3D SPI machine.
based on the analysis of empirical data from a database or physical sensors. The Pi series 3D SPI inspection
systems’ revolutionary ergonomics and award-winning programming simplicity are made possible using patented machine learning algo- rithms. The principle is simple. Only information that the system cannot
Dedicated Ti tanium Selective Solder Nozzle
team developed an algorithm that allows the system to learn how to locate the paste de - posits, without relying only on the location patterns, which
are often insufficient, due to the stretch or warpage of the board. This algorithm allows the user to
measure the “0” height reference point of each pad, taking into account the copper thickness, in order to obtain extremely accurate height measure- ment of each solder paste deposit. This patented algorithm gives the PI series
Machining Services
its exceptional accuracy and repeata- bility, while offering ergo nomics and programming simplicity. The software platform of Vi’s K3D AOI systems now integrates next-generation algorithms for programming. When creating the inspection program for a new board, all of the
components available in the library
are automatically recognized. Contact: Vi TECHNOLOGY,
Inc., 320 Newburyport Turnpike, Rowley, MA 01969 % 978-337-7586 E-mail:
jay.gauthier@
mycronic.com Web:
www.vitechnology.com
See at IPC APEX, Booth 1336 Practical Components
Los Alamitos, CA — Practical Components is showcasing mechani- cal IC samples or “dummy” compo- nents and SMT production tools and equipment at IPC APEX 2020. The company is offering a new SMTA sol- der paste test vehicle for miniatur- ized surface mount technology. Customers can optimize stencil printing and reflow with this test vehicle to help develop robust capa- bilities for components as small 008004 and 01005 (0201 and 0402 metric) and 0.012 in. (0.3mm) pitch array packages. Practical Components is also
showing advanced wafer bumping technology chips, test vehicles and wafers, such as the MB6020 with pad pitches of 60, 55, 50, 45, 50, 35, 30, 25, and 20 µm. The company is offering a large
variety of advanced test wafers, which are daisy-chain or for wire- bonding and can be supplied diced or
Adjustable SMT Ful l Process Carrier
as an uncut whole wafer. Available are 6, 8 and 12 in. (152, 203 and 305 mm) wafers, as well as matching sub- strates in a variety of pitches from 20 to 200 µm. Test wafers are offered with Cu pillar and SnAg solder caps, SAC305 bumps, Ni with SnAg plate or with no bumps. Also available are glass die and
wafers with Cu pillar in 150 or 200 µm pitches, dummy eWLP-wafers — 0.4-CuPd-DC-NB 8 in. (203 mm) wafer-embedded copper pads, and dummy CSPnl-wafers — 0.4-DC- SAC405 8 in. (203 mm) wafers with SAC405 ball daisy-chained with 0.02 in. (0.4 mm) pitch. The company has recently up-
dated its website. See demo. Contact: Practical Components,
Inc., 10762 Noel Street, Los Alamitos, CA 90720 % 714-252-0010 E-mail:
mkennedy@practicalcomponents.com Web:
www.practicalcomponents.com
See at IPC APEX, Booth 1600
Manual Sl ide Line (Combo-Slide)
Advanced Dummy Components from
Wet ted Select ive Solder Nozzles
PCB Assembly and Handling Solutions
Custom Selective Solder Fixture
Assembly Fixture (Flip-Rak)
1 Gwinnup Road • Blairstown, NJ 07825 Phone: 908.362.5588 • Fax: 908.362.5115
cs@mb-mfg.com •
WWW.MB-MFG.COM
Adjustable Wave Solder Fixture
Ti tanium Finger Masks Board St i f feners
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