Next Month’s Focus: Test and Inspection Send News Releases for: APEC VOLUME 36 - NUMBER 2
Product Preview: IPC APEX and
ATX/MD&M West February, 2020
Man in the Middle: Automation and the Changing Workplace
By Michael Skinner, Editor
SEC showcases its X-eye SF160 series 3D CT X-ray in- spection system. Product pre- views begin on…
Page 94
Handheld Material Analysis from Insituware
Phoenixville, PA — Doomsday scenarios of the relentless pace of automation and massive unemployment leave many concerned about the future. On the other hand, a rosy view of lights-out factories and universal basic in- come is, at this point, unrealistic. The solution lies some- where in between: man and machine each relying on the strengths of the other and working closely together. According to research firm Forrester, more than one million knowledge-work jobs will be replaced by automa-
tion this year. Virtual assistants, management software and machine learning will all play a central role. On the flip side, however, it is predicted that around 300,000 new jobs that require human touch, intuition, empathy, and adaptability will be created. In 2019, robotic process automation (RPA), which is
a term for the software that defines rules-based tasks for a computer to perform, was the fastest growing segment of enterprise software. Gartner predicts that RPA spend- ing will reach $1.3 billion in 2020. While interest in RPA has been strong, adoption is finally catching up. Processes that can benefit from RPA typically have four characteristics. They are rule-based, re- peated regularly, have defined inputs and outputs, and have enough volume to be worth the effort. In electronics manufacturing, automation con-
tinues to have an irreversible and widespread im- pact. From the increase of automated component storage and AGVs tracking the factory floor replac- ing feeders to machine learning algorithms optimiz- ing inventory management, process automation is the path to greater efficiency for manufacturers of all sizes, mixes and volumes. The way automation is presented, human
Insituware launches an inno- vative handheld solution for analyzing materials on the shop floor. EMS section begins on…
Page 18 This Month’s Focus:
Assembly and Automation
Despite significant benefits to efficiency and
productivity, many workers fear for their jobs in the face of greater automation.
workers are not to be simply shoved out by robots, but rather change their focus to more meaningful tasks. This also eliminates the possibility of human error in tasks like data entry. An unpleasant side effect, according to For- rester, is the possibility that resolving process issues
Continued on page 8
Meeting Automotive Solder Reliability Demands
By Watson Tseng, General Manager, SHENMAO America, Inc.
Rehm improves automated condensation soldering; ASM furthers the integrated smart factory; Mycronic discusses AI in SMT assembly. Special fea- tures begin on…
Page 76
ments continue to increase in auto- motive devices. Automotive devices are expected to be smaller, lighter, multifunctional, and provide quick- response communications. Reliabili- ty is emerging as a top priority, since it is directly related to the safety of drivers and passengers. Reliability requirements for automotive devices are much more strict than those for consumer electronic products, while
W
hile the future of auto - nomous vehicles is promis- ing, demands and require-
taking into consideration the impact of the extreme environment, chang- ing seasons and vibration while driv- ing. As a result, extremely high-reli- ability devices are necessary.
Strengthening Solder Joints Thermal cycle test (TCT) is a
method used to evaluate the reliabil- ity of electronic products. Thermal cycling is performed under harsh conditions of extreme high/low tem- perature cycling. The critical failure factor in TCT is thermal stress that comes from coefficient of thermal ex- pansion (CTE) mismatch during the temperature cycle. The CTE mismatch within an
assembly structure can be signifi- cant. Failures occur under continu- ous thermal impact of expansion and contraction. Solder joints play an im- portant role connecting the package and the PCB and provide electrical
Continued on page 6
New Method Creates Robust Transistors
Linköping, Sweden — A new method to fit together layers of semiconduc- tors as thin as a few nanometers has resulted in a new type of transistor for high-power electronics. The achievement is due to the close col- laboration between scientists at Linköping University (LiU) and Swe- GaN, a spinoff company from materi- als science research at LiU. The com- pany manufactures tailored electron- ic components from gallium nitride. Gallium nitride (GaN), is a semi-
conductor used for efficient LEDs. It may, however, also be useful in other applications, such as transistors, since it can withstand higher temperatures and current strengths than many oth- er semiconductors. These are impor- tant properties for future electronic components, not least for those used in
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