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February, 2020
Meeting Automotive Solder Reliability Demands
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Continued from page 1
and a mechanical bonding. The ther- mal stress from CTE mismatch also impacts solder joints. The solution: increase the solder strength to pre- vent thermal fatigue. There are two main ways to
strengthen solder. The first is disper- sion strengthening, which introduces a second phase, like intermetallic compounds (IMC), through the addition of an alloying ele- ment such as silver, copper, etc. The silver content affects solder mechanical properties. The higher in silver, the finer the dispersed Ag3Sn IMC and solder matrix grain size, re- sulting in high strength and fatigue resistance. This trans- lates directly to increased reli- ability. To date, SnAgCu is the ideal lead-free solder alloy for most applications. Sn4Ag0.5Cu, also known as SAC405, is a popular can- didate when thermal reliability is taken into consideration. The second method used to in-
crease solder strength is solid solu- tion strengthening, which involves adding atoms of one element (addi- tive) to the crystalline lattice of the base element (tin). The local nonuniformity in the
crystalline lattice is induced by the atom size difference of additive and tin. Larger differences in size create more distortion of the crystalline lat- tice, resulting in higher strength. Bismuth, indium and antimony are common candidates for solid solution strengthening in solder alloy.
Thermal Reliability To keep pace with the require-
ments and demands of the automo- tive electronics industry, high-relia- bility lead-free alloys must be devel- oped. These must have higher ther- mal cycle reliability than SAC405, similar soldering temperature to
that of a typical SAC solder alloy and good soldering ability. In addition, all hazardous substances, like lead, must be avoided to meet all RoHS re- quirements. SHENMAO has developed a
new high-reliability solder alloy to meet all of these needs. SHENMAO’s PF916-S and PF918-S are solder al- loys with silver, bismuth and other
Solid solution strengthening.
minor additives, with a similar sol- dering temperature window to SnAgCu alloys, allowing for easy adoption into existing packaging processes. PF918-S has higher thermal re-
liability performance than typical solder alloys, such as SAC305 and SAC405, and is suitable for use in automotive electronics applications. While PF918-S provides improved thermal reliability, SHENMAO’s PF916-S, which is doped with anti- mony, has excellent performance in both thermal cycling and mechanical shock. Both high-reliability alloys ex- hibit similar melting behavior to SAC405, as well as excellent tensile strength and ductility, making them ideally suited for use in high-reliabil- ity automotive soldering applica- tions. Contact: SHENMAO America,
Inc., 2156 Ringwood Avenue, San Jose, CA 95131 % 408-943-1755 fax: 408-684-5477 E-mail:
usa@shenmao.com Web:
www.shenmao.com r
See at IPC APEX, Booth 3253 Contents SCS PRECISIONCOAT V
Tech-Op-Ed ........................... 4 Tech Watch ........................... 10 People.................................... 12 Business News......................... 14 Business Briefs........................ 15 Management......................... 16 EMS .................................... 18 ElectronicMfg. Prods............. 28 Production............................ 68 Partnering............................. 70 Distribution........................... 74 New Products....................... 128 High-Tech Events................... 140 Editorial Calendar................. 140 Advertisers Index................... 142
Special Focus: Assembly and Automation........ 76
Product Preview: IPC APEX, ATX / MD&M West.................... 94
See at IPC APEX, Booth 2913, and at ATX / MD&M West, Booth 3131
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