September, 2016
www.us-
tech.com
inTEST Intros IC Temperature Characterization System
Mansfield, MA —Called a “breakthrough in IC tem- perature characterization,” by inTEST, the compa- ny’s new Temptronic® ThermoSpot benchtop system has been designed to offer temperature forcing with- out the use of thermoelectric (TE) modules. Nearly all benchtop systems on the market
today use TE components or Peltier cooling where performance degrades during thermal cycling over wide temperature ranges. Using proprietary refrig- eration, the ThermoSpot delivers highly responsive temperature forcing without TE modules. Removing this common source of performance loss and poten- tial failure, the ThermoSpot can run continuously while maintaining full cooling capacity and its relia- bility is not dependent on the application. While TE modules are reliable in applications
involving relatively steady-state cooling, they are subject to fatigue with large temperature changes and thermal cycling. The reason is uneven stresses on module materials due to different
by 50 Percent Isle of Wight, UK — EVS Inter - national has added the EVS 8KLF to its line of solder recovery systems, which includes the EVS 500 and EVS 500LF. The simple, yet ruggedly designed EVS 500 can reduce dedross- ing time by 75 percent and decrease waste dross by up to 85 percent. The system meshes perfectly with environ- mental control systems and also helps to reduce customers’ carbon footprint by making use of the latent heat already imputed to the dross to help the recovery process.
EVS Reduces Solder Consumption
ThermoSpot benchtop IC temperature characterization system.
rates of expansion over a wide temperature range. The ThermoSpot eliminates the performance vari- ability based on how the system is used. The company offers three ThermoSpot mod-
els that span a temperature range from –65 to +175°C (–85 to +347°F) with a cooling capacity up to 55W at –55°C (–67°F). A touchscreen controller permits the programming of temperatures, graph- ing, data logging, diagnostics, and other functions. Using DUT control, with a thermocouple or diode, the system provides fast and precise transitions to
temperature at the DUT. Contact: inTEST Thermal Solutions, 41
Hampden Road, Mansfield, MA 02048 % 781-688-2300 E-mail:
sales@intestthermal.com
Web:
www.intestthermal.com See at SMTAI, Booth 901
Page 95
EVS 500 and 500LF solder recovery systems. The EVS 500LF is highly
ISO14001-compatible and is a lead- free version of the EVS 500. The sys- tem enables the user to reduce solder consumption by up to 50 percent. The system has been designed to be the same size as a printer and is aimed at multiple markets. It is useful for customers with both mixed lead and lead-free waves, and for those who use and would like to reduce their use of nitrogen. The EVS 8KLF offers a capacity
of 6 kg (8 lb). Its integrated hopper makes rapid transfer of dross sim- pler and safer and speeds dedrossing times by up to 75 percent. This pro- vides a cleaner wave with less main- tenance, less downtime, and a reduc- tion in shorts and bridging, as well as the potential to discontinue the use of messy wave oils and/or dross
reduction powders. Contact: EVS International,
Porchfield Business Park, Unit 2, Porchfield, Newport, Isle of Wight PO30 4QB, UK %+44-0-8451-30-47-33 E-mail:
sales@evsinternational.com Web:
www.solderrecovery.com
See at SMTAI, Booth 826
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