Page 60
www.us-
tech.com
September, 2016 Using Machine Vision to Improve Laser Material Processing Continued from page 58
markers, 2D data codes or lettering on the part. These characters are programmed beforehand using the intuitive recognition tools of the compa- ny’s weldMARK® vision software user interface. The control software then selects the appro-
priate laser program for the part type identified. In this respect, the system therefore does not rely on integration with system control. Software algo- rithms adapt the laser process to the part’s system of coordinates. With two mirrors controlled by gal- vanometers, the scanning head can direct the laser beam to any point on the part within its field of work. Once the process is completed, the software verifies that it has been successfully executed and
means that the laser and camera use the same scan- ning head mirrors to “look” at the object, as well as the same F-theta lens. As a result, this setup offers inherent compensation for temperature-dependent
welding and deep engraving in the automotive industry, and ITO patterning in the electronics sector all gain from the high degree of precision offered by contact-free laser processing. In the microchip industry, sensitive wafer
plates are laser-etched along their crystal planes. Every single wafer has to be analyzed prior to the laser process. If the inspection is successful, the MVC adjusts the laser process to the exact position of the wafer and the orientation of the silicon crys- tal planes, with tolerances of just a few microme- ters. The detection of position and orientation, as well as the subsequent quality assurance by the MVC eliminate some of the costs associated with high-precision mechanical wafer positioning. This not only simplifies the mechanical construction process but also protects the sensitive wafers from mechanical damage by positioning equipment.
Schematic structure of on-axis machine vision control.
drift in the deflection unit, which causes deviations between the interpreted laser position and its actu- al position. The on-axis technique enables particu- larly small working distances with the shortest focal lengths of less than 50 mm, while offering levels of precision down to 10 µm. The benefit provided by machine vision for
On-axis machine vision control combining a laser deflection unit with a camera coupled into the path of the laser beam.
documents the result. The MVC software offers a wide range of optical analysis options, while “click and teach” simplifies and accelerates the creation of a laser job to suit each new type of part.
The Eye of the Laser In the on-axis version of MVC, the camera is
coupled into the optical path of the laser beam. This
laser processes can also be exploited in “off-axis” applications, where one or more cameras (but usu- ally not more than four) are installed outside of the deflection unit. This technology has much to offer, in particular in the case of “on-the-fly” applica- tions, were the workpiece is constantly moving throughout processing, or where large parts of the workpiece need to be captured quickly.
Industrial Applications The integration of machine vision and laser
systems increases efficiency in many manufactur- ing processes across a wide range of industries. Applications such as perforation in the packaging industry, laser cutting in the textile industry, laser
CableEye® HVX System The Smarter HIPOT Tester!
See What It Can Do for You!
00)
GΩ
camiresearch.com/hipot +1 (978) 266-2655
4-Wire Kelvin to 1mΩ Available
Sample Screen Report
2100 Vdc 1200 Vac
128-Point HVX System
Individual solar panels must be welded together with precision.
In the manufacturing of solar cells, the ener-
gy-absorbing photovoltaic panels are put together from the sensitive crystalline wafer plates. This
Continued on page 70
Demo Systems
Available!
CAMI
® CAMI Research Inc.
sales@camiresearch.com
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116