September, 2016
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IPC to Create Automotive/Aerospace Press-Fit Pin Standard
Bannockburn, IL —IPC —Asso ciation Connecting Electronics Indus tries® has announced plans to develop a new standard covering the qualifications
SMTA / IWLPC Workshops
Continued from previous page
potential to change the electronic packaging industry by eliminating wirebond and bump interconnections, substrates, leadframes, the traditional flip chip or wirebond chip attach, and underfill assembly technologies in many applications. This course will cover the advantages of FOWLP, potential application spaces, package structures available in the industry, process flows, material challenges, design rules, reliability, and bench- marking. Next, “Wafer Level Packaging
for the Functional Integration of MEMS and ICs” will be presented by Chip Spangler of Aspen Micro - systems. The development of wafer level packaging (WLP) has been a major driving force for the size and cost reduction of integrated circuits as well as MEMS, microsystems, micro-optical, and micro-fluidic prod- ucts. These devices require special- ized packages that protect the microstructures and still allow the desired signals to pass through the package to the die. The challenges and costs associated with MEMS packaging has, since the 1970s, driv- en the development of WLP and asso- ciated technologies. Recently, the demand for multi-sensor products, greater levels of sensor intelligence and the connectivity requirements of IoT applications has driven the com- plex integration of MEMS and ICs through the use of WLP technologies. Chet Palesko of SavanSys Solu -
tions and Jan Vardaman of Tech - Search International will host a work- shop entitled “Choosing the Right IC Packaging.” During the session they will analyze the performance and size characteristics of traditional (lead- frame options, wire bond PBGA, flip chip PBGA) and advanced packaging (WLP, FOWLP options, embedded die, 2.5D/interposer-based packaging, and 3D packaging with through-silicon vias). For each packaging technology, this course also provides a detailed cost analysis including the manufac- turing process flow to fabricate and assemble the package and the domi- nant technology cost drivers. The final session, “Recent Ad -
vances and New Trends in Semi - conductor Packaging,” will be given by John Lau of ASM Pacific Technology. The lecture will cover recent advances in FOWLP, 3D IC packaging, through- silicon vias, microbumps, 3D IC inte- gration, 2.5D IC integration, embed- ded 3D hybrid integration, thin wafer handling, thermal management, and many other topics. Patents impacting semiconductor packaging will be men- tioned first and patent issues with fan- out wafer and panel level packaging will be covered as well. Contact: SMTA, 6600 City West
Parkway, Suite 300, Eden Prairie, MN 55344 % 952-920-7682 fax: 952- 926-1819 Web:
www.smta.org
and acceptance require ments for press-fit pins used in the automotive, aerospace and other industries. The highly-anticipated stan-
dard was first requested by members of the European automotive electron- ics industry as there is currently not an auto/aero standard for high-relia- bility press-fit pin technology. The standard is expected to be released in late 2017. The IPC standards devel- opment process will bring together design and assembly task groups in a collaborative effort to create applica- ble documents for both groups. “This newly-proposed standard
is exciting for multiple reasons. First, it is a document specifically requested by the European automo-
tive electronics industry and is fur- ther evidence that European stake- holders are embracing IPC’s efforts to engage them in the global stan- dardization process,” says Dave Bergman, IPC vice president of stan- dards and training. “In addition, it will help to close a technology hole in IPC’s standardization tree by adding a fresh look at the use of press-fit pin technology in electronic hardware.” The document will be IPC’s sec-
ond significant standard developed for the automotive electronics indus- try. The development of standards is one of IPC’s core services and the automotive electronics industry is one of the key verticals in Europe. “IPC views this press-fit stan-
dard activity as an important step in our mission to deliver value to our growing membership in Europe, and to help make them more financially successful,” adds Sanjay Huprikar, IPC vice president of member success. Huprikar describes
IPC’s
European members as having strong voices in the development of the organization’s educational offerings and events. The IPC has been encouraging its European members to get more involved in developing standards for the industry. Contact: IPC, 3000 Lakeside
Drive, Suite 105 N, Bannockburn, IL 60015 % 847-615-7100 fax: 847-615-7105 Web:
www.ipc.org
September 25-29, 2016 Exhibition:
Conference: September 27-28, 2016
Donald E. Stephens Convention Center Rosemont, IL
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IPC Standards Development Commitee Meetings Exhibition is Co-Located with Sensors Midwest Expo
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