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Fast Forward Platform Aids Startups at electronica
Munich, Germany — The Fast For - ward startup platform at electronica has much to offer aspiring entrepre- neurs. From making new contacts and meeting possible investors, to sales support and legal advice, startups face a number of challenges. To meet some of these needs, elec-
tronica is providing a platform for startups to present their technology and products. Whether a startup company has
a product and a business plan or sim- ply creativity and an idea, the Fast Forward platform is a venue for every kind of entrepreneur. Foun ders and developers can submit their projects to a panel of judges in “Idea,” “Prototype” and “Startup” categories for a chance to present in front of an international audience. A number of different start- ups from more than 17 countries, including Australia, China, Russia, and the U.S., have already submitted
material for consideration. Scheduled for November 8-11, 2016, electronica will take place at the Munich Expo Fairgrounds in Munich, Germany. A Belgian startup has submit-
ted a promising solution involving compact 3D printers that can be used to manufacture aluminum parts without relying on lasers, high volt- age or metal powder. In the Prototype category an
Austrian team has developed a system that uses instant messaging to alert parents or emergency responders if children or pets left in a car are in dan- ger from high temperatures or a lack of oxygen. Several sensors detect whether someone is still in a given vehicle and determines the location. In the event of an emergency, the system first notifies the car’s owner. If the owner does not respond, the system then notifies emergency services. The Munich-based startup eCozy
SMTA Finalizes IWLPC Workshops
Eden Prairie, MN — The SMTA has finalized the workshop schedule for the 13th annual International Wafer-Level Packaging Conference (IWLPC). The conference will take place from October 18-20 at the DoubleTree Airport Hotel in San Jose, CA, with the workshops being held on Thursday, October 20. The first workshop is entitled
“Introduction to Fan-Out Wafer Level Packaging” and will be presented by Beth Keser of Qualcomm. Fan-out wafer level packaging (FOWLP) tech- nologies have been developed over the past 15 years and have been in high- volume manufacturing for almost a decade. FOWLP has matured and has come to a crossroads where it has the
Continued on next page 2017 ISSUE Jan/Feb March April/May EDITORIAL
Production & Packaging Electronics West/MDM PP APEX PP APEX
Test & Measurement ATX Midwest PP
SMT & Production Nepcon China PP SMT/Hybrid/PKG PP EDS PP
June July August
Components & Distribution ATX East /MDM PP Test & Automation
Semicon West/Intersolar PP
Production & Packaging Nepcon South China PP
September PCB & Automation SMTAI PP
Nepcon South China
Autotestcon WESTEC
PCB West SMTAI IMAPS
October
Assembly & Production Productronica PP
The Assembly Show South-Tec FABTECH
MDM Minneapolis Productronica
Nov/Dec
Components & Distribution Electronics West/MDM PP
PP= Product Preview ATX/ Electronics West/ Aug. 29-31
Sept. 12-14 Sept. 12-14 Sept. 13-15 Sept. 19-20 Oct. 10-12
Oct. 24-26 Oct. 24-26 Nov. 7-9 Nov. 8-9 Nov. 14-17 Feb. 13-15
Shenzhen, China
Schaumburg, IL Los Angeles, CA Santa Clara, CA Rosemont, IL Raleigh, NC
Rosemont, IL Greenville, SC Chicago, IL
Minneapolis, MN Munich, Germany Anaheim, CA
SHOW DesignCon
ATX/ Electronics West/MDM APEX
APEC ATX Midwest
Nepcon China ESC
Wire Processing Tech SMT/Hybrid/PKG Eastec EDS
ATX East /MDM SEMICON West/Intersolar
EDITORIAL CALENDAR DATE
LOCATION
Jan. 31-Feb. 2 Feb. 7-9 Feb. 14-16
March 28-30 March 29-30
April 25-27 May 3-4 May 11-12 May 16-18 May 16-18 May 16-19 June 13-15
July 11-13
Santa Clara, CA Anaheim, CA San Diego, CA
Tampa, FL Cleveland, OH
Shanghai, China Boston, MA Milwaukee, WI
Nuremberg, Germany Las Vegas, NV New York, NY
San Francisco, CA
has developed an intelligent thermo- stat to display at electronica, which is designed to provide energy-efficient heating for private use. The thermo- stat records the homeowner’s tempera- ture preferences and uses an algorithm to optimize heating and cooling condi- tions, cutting energy consumption sig- nificantly. Companies that participate in
the electronica Fast Forward program are given exhibition space in the East Entrance along with a schedule of forums and discussions that allow them to learn from experienced advi- sors. Other founders can share their
experiences and investors can offer valuable tips. As a special highlight for young entrepreneurs everyone participating has a chance to win the “Fast Forward Award.” The award includes international PR, consulting and marketing support worth about $170,000. Sponsors of the event include STMicro electronics N.V. and the Würth Group. Contact: Messe München
GmbH, Messegelande, 81823 Munich, Germany % +49-89-949- 20720 fax: +49-89-949-20729 E-mail:
info@messe-muenchen.de Web:
www.messe-muenchen.de
Trade Show Calendar MORE SHOWS:
www.topline.tv/tradeshows.cfm
September 21-22, 2016, MD&M Minneapolis. * Minneapolis Convention Center, Minneapolis, MN. Contact: UBM Canon, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
www.ubmcanon.com
September 25-29, 2016, SMTA International Conference and Exhibition. * Donald E. Stephens Convention Center, Rosemont, IL. Contact: SMTA, 6600 City West Parkway, Suite 300, Eden Prairie, MN 55344 % 952-920-7682 fax: 952-926-1819 Web:
www.smta.org
October 11-12, 2016, IMAPS 2016. * Pasadena Convention Center, Pasadena, CA. Contact: IMAPS, P.O. Box 110127, Research Triangle Park, NC 27709 % 919-293-5000 fax: 919-287-2339 E-mail:
modonoghue@imaps.org Web:
www.imaps.org
October 23-26, 2016, IEEE Compound Semiconductor IC Symposium. * Doubletree
by Hilton, Austin, TX. Contact: IEEE, 3 Park Avenue, 17th Floor, New York, NY 10016 % 212-419-7900 fax: 212-752-4929 Web:
www.ieee.org
October 25-27, 2016, The Assembly Show. * Donald E. Stephens Convention Center,
Rosemont, IL. Contact: BNP Media, 2401 W. Big Beaver Road, Suite 700, Troy, MI 48084 % 248-362-3700 E-mail:
amy@theassemblyshow.com Web:
www.theassemblyshow.com
November 8-11, 2016 electronica.*Messe München, Munich, Germany. Contact: Messe München GmbH, Messegelande, 81823 Munich, Germany % +49-89-949-20720 fax: +49-89- 949-20729 E-mail:
info@messe-muenchen.de Web:
www.messe-muenchen.de
November 15-17, 2016, International Test Conference. * Fort Worth Convention Center, Fort Worth, TX. Contact: Contact: IEEE, 3 Park Avenue, 17th Floor, New York, NY 10016 % 212-419-7900 fax: 212-752-4929 Web:
www.ieee.org
November 16-17, 2016, Printed Electronics USA. * Santa Clara Convention Center,
Santa Clara, CA. Contact: IDTechEx, One Boston Place, Suite 2600, Boston, MA 02108 % 617-577-7890 fax: 617-577-7810 E-mail:
info@idtechex.com Web:
www.idtechex.com
November 29-December 1, 2016, SMTA LED A.R.T. Symposium. * Crowne Plaza Midtown, Atlanta, GA. Contact: SMTA, 6600 City West Parkway, Suite 300, Eden Prairie, MN 55344 % 952-920-7682 fax: 952-926-1819 Web:
www.smta.org
December 7-9, 2016, IPC APEX South China. * Shenzhen Convention & Exhibition
Center, Shenzhen, China. Contact: IPC, 3000 Lakeside Drive, 105 N Bannockburn, IL 60015 % 847-615-7100 fax: 847-615-7105 Web:
www.ipc.org
December 14-16, 2016, SEMICON Japan. * Tokyo Big Sight, Tokyo, Japan. Contact: SEMI, 3081 Zanker Road, San Jose, CA 95134 %408-943-6900 fax: 408-428-9600 Web:
www.semi.org
January 5-8, 2017, CES. *Las Vegas Convention Center, Las Vegas, NV. Contact: Consumer Technology Association, 1919 S Eads Street, Arlington, VA 22202 % 866-233-7968 E-mail:
cesreg@cta.tech Web: www.ces.tech
January 18-20, 2017, NEPCON Japan. *Tokyo Big Sight, Tokyo, Japan. Contact: Reed Exhibitions (Shanghai) Co. Ltd., 42F Intercontinental Center, 100 Yutong Road, Zhabei District, Shanghai, 200070 % +86-21-2231-7000 fax: +86-21-2231-7181 E-mail:
linda.gao@
reedexpo.com.cn Web:
www.nepconsouthchina.com
January 31-February 2, 2017, DesignCon. *Santa Clara Convention Center, Santa Clara, CA. Contact: UBM Canon, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
www.ubmcanon.com
February 7-9, 2017, MD&M West.*Anaheim Convention Center, Anaheim, CA. Contact: UBM Canon, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
www.ubmcanon.com
February 14-16, 2017, IPC APEX Expo. *San Diego Convention Center, San Diego, CA. Contact: IPC, 3000 Lakeside Drive, 105 N Bannockburn, IL 60015 % 847-615-7100 fax: 847- 615-7105 Web:
www.ipc.org
September, 2016
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