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September, 2016


www.us- tech.com


Indium Offers Solder Paste and Reinforced Preforms


Clinton, NY — Indium Corporation has developed a halogen-free, no-


to reduce voiding while delivering high transfer efficiency with low variability. The no-clean paste is good for a


variety of applications, especially automotive, due to its oxidation barri- er technology. In addition to outstand- ing print transfer and re sponse-to- pause, the solder paste also provides a number of other benefits, including excellent pin-in-paste solderability and hole fill, robust reflow capability, and a wide process window. The company also offers its InFORMS®, which are reinforced sol-


der preforms designed to maintain constant bondline thickness and improve thermal cycling reliability. This is a key requirement in many applications, including die-attach and baseplate attach for IGBTs. According to a study reported


by the company, InFORMS were used to solder a DBC and baseplate of an IGBT and achieved four times the thermal cycling reliability when compared with a preform only approach, two times the thermal cycling reliability when compared with a preform and wirebond stitch


approach, and less than one percent voiding throughout. The preforms also offer a low cost of ownership, as they can be used as a drop-in replace- ment for standard preforms or solder paste and require no additional


process steps or equipment. Contact: Indium Corp., 34


Robinson Road, Clinton, NY 13323 % 315-381-7524


E-mail: abrown@indium.com Web: www.indium.com


See at SMTAI, Booth 429 and IMAPS, Booth 710


Page 89


Indium8.9HF no-clean solder paste.


clean solder paste, Indium8.9HF. The paste is specifically formulated


New Optilia Inspection Equipment Distributed


by Ascentech Chester, CT — Ascentch, the North American distributor for Optilia Instruments AB and for Gen3 Sys - tems, is introducing new products from each company to the North American market. Ascentech is launching Optilia’s high-definition camera system and Gen3’s solder saver, a solder/dross separation tool. The distributor also offers the Gensonic ultrasonic stencil cleaner, Optilia’s BGA inspection scope, and many other products. Optilia offers obstruction-free,


fatigue-free, HD benchtop inspection systems for PCB assembly and real- time BGA inspection. Gen3’s solder saver is a handheld, compact system for separating dross from good sol- der. The unit easily reduces hard- ened dross material to oxide powder making it possible to remove the dross oxide waste from the solder pot, leaving valuable solder in the


Optilia HD camera inspection system.


pot. The Gensonic is a manually- operated, ultrasonic transducer unit for cleaning stencils used in printing solder pastes and adhesives. It can be used either directly on the printer


or at a separate cleaning station. Contact: Ascentech LLC, 127


Goose Hill Road, Chester, CT 06412 % 860-526-8903


E-mail: rallinson@snet.com Web: www.ascentechllc.com


See at SMTAI, Booth 219 See at SMTAI, Booth 412


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