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September, 2016
Mirtec Offers 3D AOI and 3D SPI Systems
ISO 9001: 2008 Certified
Oxford, CT —Mirtec offers a range of automated inspection systems including its MV-6 Omni 3D AOI and MS-11e 3D SPI systems. According to the company, the market demand for the two systems has led to three straight quarters of unprecedented growth for the organization. The MV-6 Omni 3D AOI
Machine is configured with the
company’s exclusive
Omnivision® 3D inspection technology, which combines a 15 MP CoaXPress camera with Mirtec’s digital multi- frequency quad Moiré 3D sys- tem in a newly-designed cost- effective platform. The compa- ny’s 15 MP CoaXPress vision system is a proprietary camera system designed and manufactured by Mirtec for use with its complete prod- uct range of 3D inspection systems. The company’s digital multi-fre-
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quency quad Moiré technology, pro- vides true 3D inspection using a total of four programmable digital Moiré projectors to yield the precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured, the new MV-6 Omni machines contain four 10 MP side-view cameras in addition to the 15 MP top-down camera. The MS-11e 3D SPI machine is
also configured with the company’s 15 MP CoaXPress vision system, pro- viding enhanced image quality, supe- rior accuracy and fast inspection rates.
The machine uses dual projec-
tion “shadow-free” 3D Moiré technol- ogy combined with a precision tele- centric compound lens and precision laser PCB warpage compensation to accurately characterize each solder
MV-6 Omni 3D AOI system.
deposition after screen printing. The MS-11e measures solder
volume, area, shape deformity and x/y position, and inspects for bridg- ing between adjacent solder deposi- tions. Furthermore, the MS-11e pro- vides real-time closed-loop feedback to the screen printing system to effectively eliminate defects before they occur. The company also offers its
total quality management system software, Intellisys®, which promotes continuous process improvement by allowing manufacturers to track and eliminate defects on inspected
assemblies. Contact: Mirtec Corp., 3 Morse
Road, Oxford, CT 06478 % 203-881-5559 fax: 203-881-3322
E-mail:
bdamico@mindspring.com Web:
www.mirtec.com
See at SMTAI, Booth 707
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