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tech.com
September, 2016
Using Machine Vision to Improve Laser Material Processing
By Wolfgang Lehmann, Raylase AG
to its speed, accuracy and effective- ness. Lasers are used to engrave parts, PCBs or chip cards. They per- forate packaging, structure semicon- ductor wafers, drill, cut and weld plastics or metals, and create highly- complex structures through 3D printing — all contactless, with no application of force. Conventional systems for laser
T
material processing require a large number of individual components and the mechanics and control soft- ware have high integration costs. Depending on the application, a sys- tem has to inspect the characteristics of each part even before laser pro- cessing begins. Following the laser process, an additional unit then inspects the quality. The positioning of the parts in
the laser system determines its accu- racy to a large degree. Unfor tunately, this positioning is extremely compli- cated from a mechanical point of view, as well as costly. If various types of parts are to be processed in a laser system, the laser system will need to be integrated into production control at a deep level. Raylase AG set itself the goal of
making it easy for manufacturers, integrators and researchers to take advantage of the powerful properties
he use of today’s laser technol- ogy has become standard in industrial manufacturing due
of lasers. The company offers high- precision components for fast deflec- tion and modulation of laser beams,
Laser systems based on MVC can optically inspect parts, identify the type of each part, and allow parts to
ground-breaking in the area of man- ufacturing automation. The most fre- quently cited benefits are increased safety, traceability, the saving of materials and improved quality com- bined with greater resource efficien- cy and productivity. In the laser process, optical
Elaborate holding device for the handling of semiconductors.
as well as functional assemblies and solutions for laser processing. One of its latest innovations has been to combine a laser deflection unit with industrial cameras and special machine vision software.
Today’s Machine Vision The company has developed
Machine Vision Control (MVC) sys- tem, which enhances conventional laser deflection units with the fea- tures of today’s machine vision.
be placed in virtually any position in the laser. This increases precision, speed
and integration capabilities, while significantly reducing the costs asso- ciated with laser systems. In recent years, machine vision has estab- lished itself as an enabling technolo- gy in industrial manufacturing. High-precision quality inspection, contact-free measurement and process control based on optical image analysis make this technology
measuring technology in conjunction with industrial cameras and soft- ware algorithms enables the posi- tioning and rotation of the laser rela- tive to the part with micrometer pre- cision. As a result, only a simple mechanism is required to place the parts in the laser field. The machine vision unit also offers native optical inspection of the quality of the parts. Geometric dimensions, color, texture, surface characteristics and overall appearance can be inspected in a direct variance analysis. Raylase MVC, combining laser technology with machine vision, is paving the way to Industry 4.0, the basis for highly flexible manufacturing sys- tems that can be configured entirely by software and can be operated more efficiently in terms of both time and costs while also ensuring improved production quality. The camera, which is either
integrated into the laser deflection unit or mounted on it, identifies the type, position and orientation of the part using object dimensions and
Continued on page 60
Unitech UC-250M-CV Board Cleaner
Winner of the 2016 NPI Award for Cleaning Equipment!
The UC-250M-CV Board Cleaner offers a dual cleaning feature using a combination of a brush roller with the silicone/adhesive cleaning rollers. The combination dual dust removal system assures better results than a single brush or adhesive roller system. The UC-250M-CV has the ability to clean the top surface of PCB even chip components attached on the bottom-side. Additionally, the cleaner features an antistatic bar (ionizer) to neutralize static and prevent dust from collecting on the top surface of the PCB.
TheUC-250M-CVBoardCleaneroffe ersa
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