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www.us-
tech.com
September, 2016
Nordson YESTECH: High Powered 3D AOI System
Carlsbad, CA — Nordson YESTECH now offers its FX-940 Ultra 3D AOI with cutting-edge 3D technology for the inspection of solder defects, lead defects/tilted leads, component pres- ence and co-planarity of chips, BGAs and other height-sensitive devices. With its advanced fusion light-
ing and comprehensive inspection tools including angled cameras, full- color digital image processing and both image and rule-based algo- rithms, the FX-940 Ultra offers com- plete inspection coverage with unsur- passed 2D and 3D defect detection. Key features of the system
include: 12 MP five-axis NYTVision Technology; complete 2D and 3D inspection capabilities; one top-down and four side-view cameras; auto- matic programming tools; high defect coverage and low false failures; and SPC data collection and reporting. YESTECH is a provider of auto-
mated optical inspection systems with integrated yield enhancement solutions for the printed circuit board assembly and advanced semiconduc-
FX-940 Ultra 3D AOI system.
tor packaging industries. Contact: Nordson YESTECH,
2747 Loker Avenue West, Carlsbad, CA 92010 % 760-918-8471 fax: 760-918-8472 E-mail:
sales@nordsonyestech.com Web:
www.nordson.com
See at SMTAI, Booth 606
Essemtec Intros Compact Pick-and-Place Machine
See at SMTAI, Booth 301
Glassboro, NJ — Essemtec’s new Fox pick-and-place machine is designed for small production environments. With linear motors and a mineral cast frame, the machine pro- vides exceptional speed, sta- bility and accuracy. The sys- tem measures 88 x 109 cm (34.65 x 42.91 in.) and accepts PCBs up to 406 x 305 mm (16 x 12 in.). Components with sizes from 0201 to 33 x 80 mm (1.18 x 3.15 in.) can be placed, with the option of up to 80 x 80 mm (3.15 x 3.15 in.) at 4,500 cph (IPC9850A) with an accuracy of 50 µm at 3 sigma. The Fox can be fitted
Neu Dynamics Corp is an ISO 9001:2008 certified Tool, Mold and Die man- ufacturer
specializing in tooling and equipment used in building
Semiconductors, Electronics, components and a wide variety of the devices used in automotive, telecommunications, solar and medical applications. We further offer small to medium volume contract molding services for
microelectronic packages such as BGA, QFN, MLP, optical components etc. We also have capability to provide insert molding services for items such as connectors.
CONTRACT MOLDING OVERMOLDING TOOLING
Phone 215-355-2460 CUSTOM MACHINING
MOLD DESIGN AND FABRICATION
WWW.NEUDYNAMICS.COM SALES@NEUDYNAMICS.COM
Fax 215-355-7365
with a dispense valve for glue or solder paste for hassle-free manufacturing of 2.5D assem- blies. The system runs the company’s ePlace software, also found on the Paraquda, Cobra and Scorpion platforms. The company’s new Spider high-
speed jet dispenser has a dispensing capability of up to 150,000 dots per hour, with a piezo jet valve, and accommodates boards up to 406 x 305 mm (16 x 12 in.) in size. With advanced laser height mapping, the system offers compensation for sub- strate warp and 3D applications. The Spider offers the same benefits as the company’s Scorpion system, but in a more compact size and with only two valves. The machine requires only 1 square meter of floor space. Not only can it work quickly,
NDC International offers specialized equipment built for today's high-tech semiconductor assembly processes.
HANMI SEMICONDUCTOR
MPP MANUAL WIRE BONDERS
K&S CAPILLARIES K&S DICING BLADES
MASTER MACHINERY CUSTOM AUTOMATION RGT WAFER FRAMES
RGT MANUAL WAFER MOUNTER
WWW.NDC-INT.COM See at IMAPS, Booth 302
but the machine is also accurate, placing dots within 50 µm at 3 sigma at full speed. With three jet speed options, basic, standard and high- speed, the system is optimized for short, ultra-fast product runs. The dispenser is available with various high-speed dispensers including a jet valve — 150,000 dots/hr; pneumatic jet valve — 80,000 dots/hr; time/pres- sure valve — 28,000 dots/hr; and an
Archimedean screw —24,000 dots/hr. Essemtec also offers the Cubus
SMT storage system, which is an innovation in how components are
Fox compact, high-speed pick-and-place machine.
stored and provisioned for electronics manufacturing. The storage tower is completely configurable and adapts dynamically to manufacturing needs. The tower reportedly has no limita- tions on the size or widths of reels or the size of JEDEC trays that it can handle. With its flexible shelf config- uration, foolproof operation and easy line integration, it adapts easily to constantly changing manufacturing environments. Due to its small foot- print and high storage capacity of up to 932 reels, the Cubus can be placed close to any SMT line. The tower interfaces easily with pick-and-place machines, greatly reducing kitting time and errors, as well as machine interruptions due to missing or mis-
placed material. Contact: Essemtec USA, 816 N
Delsea Drive, Suite 308, Glassboro, NJ %856-218-1131 fax: 856-218- 1134 E-mail:
info@essemtec-usa.com Web:
www.essemtec-usa.com
See at SMTAI, Booth 306
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