September, 2016
www.us-
tech.com Reinventing the Spring-Loaded Probe Pin Continued from previous page
formance of a pogo-style spring probe. The highly-compliant pin has a working range up to 1 mm (0.039 in.) with a flat spring rate and can be used up to 15 GHz with less than 1.0 dB loss, carry up to 4A of current, and withstand temperatures up to 200°C (392°F). Although there are a few design
tweaks, the real departure is the manner in which complete pin as- semblies are manufactured using a high-volume beryllium copper stam -
pins for high temperature burn-in, tri-temp and HAST testing where the spring-probe is regularly subject- ed to temperatures well in excess of 200°C (392°F). The ability of the pins to with-
stand higher levels of current, de- spite shrinking in size, is also an in- creasing concern — particularly with the prevalence of higher power out- put lithium batteries. “These semiconductor packages
and chips have power management features that need to be tested as
the H-pin is minimal and well within accepted levels. “For the H-pins, the variation is
minimal,” says Pal. “So, testing is pre - cise, because we can add a cutoff fac- tor for pass and fail, without having to
worry about false failures.” Contact: Plastronics, 2601 Texas Drive, Irving, TX 75062 % 972-258-2580 fax: 972-258-6771 E-mail:
sales@plastronics.com Web:
www.plastronics.com r
Suffering from any of these Solder Paste Problems?
Voids Flux Residue Slumping Printing problems Short stencil life Size comparison of an H-pin and dime.
ping process and a fully-automated, high-speed assembly and inspection process that can produce up to 400 pins per minute. Available in various lengths
and pitch sizes, the product was de- veloped by Plastronics, a global provider of test sockets for semicon- ductor reliability testing. The compa- ny has been using spring-loaded probe pins to create finished sockets for burn-in, humidity, failure analy- sis and other test requirements for more than 40 years. Depending on quantities, the
spring-loaded probe pins can cost 30 to 50 percent less. With thousands of pins in a single test socket or board- to-board connector, these savings can be significant.
Meeting High Performance Demands
For spring-loaded probe pins,
high performance characteristics are defined by the ability to withstand the high temperatures required for burn- in and other tests, the ability to carry increasing amounts of current over in- creasingly smaller pins, and the abili- ty to handle high frequencies. According to Taylor, they do not
rely on a single pin manufacturer. However, his company uses the H-
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well,” says Taylor. “The H-pins can take a lot of current.” For high-performance applica-
tions, there can be concerns about the construction of
traditional
spring-loaded probe pins and how their design can affect the quality of the connection under compression. The potential for unreliable test re- sults requires all finished pins to be tested and binned according to per- formance results — a very costly process step. According to Pal, the H-pin
solves this problem by using a leaf spring between the two plungers along with external compression spring that allows the pin to maintain a good connection and pass signal. Furthermore, the performance
of the pin as measured by its contact resistance is also a benefit during high frequency testing. Whereas standard spring-loaded probe pins can experience wide variations in contact resistance, potentially lead- ing to false failures, the variation in
ZMDI’s strength in the automotive and industrial segments provides IDT immediate design-in leverage for wireless charging, power management, and timing and signal conditioning.
Eliminating these problems starts with the flux. Higher quality flux means better solder joints, and high quality flux starts with powder.
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Page 39
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