September, 2016
www.us-
tech.com
Gen3 Offers Cleaning and Contamination Test Systems
Farnborough, Hampshire, UK — Gen3 Systems has developed test and
company offers its contaminometer™ series, which comprises the CM11+, CM22+, CM33+, CM33L+, CM60 and CMBBT. The CM+ series enables com-
plete testing within three minutes, recirculates its entire tank volume six times every minute, and fully regenerates in under six minutes. Its solid gold measuring cell and ballis- tic amplifier provides a test accuracy of less than 0.005 mS/cm. The machine also provides accurate measurements even when the pro- portion of test solution to surface
area under test is large. Measurements are made in
accordance with all international and MIL specifications both old and new.
The company also offers its
award-winning Gensonic stencil cleaning system that uses a 40 kHz on-contact ultrasonic transducer for high-efficiency cleaning of stencil apertures. The system can be used either in conjunction with Gen3 sten- cil cleaning centers or is portable enough to be taken directly to the printer.
In addition, the company manu-
factures conformal coating process equipment, both benchtop and in-line systems, and SIR, CAF, and solder- ability testing systems. The company
also offers a range of test services. Contact: Gen3 Systems Ltd.,
Unit B2, Armstrong Mall, Southwood Business Park, Farnborough, Hampshire, GU14 0NR, UK % +44-0-12-5252-1500 fax: +44-0-12-5252-1500 E-mail:
sales@gen3systems.com Web:
www.gen3systems.com
See at SMTAI, Booth 219
Page 83
Ionic contamination tester.
measurement equipment that helps predict the reliability of electronic cir- cuits and systems in the field. The
Seika Debuts Malcom SP-2 Wetting Tester
Torrance, CA — Seika Machinery has introduced its Malcom SP-2 wetting tester, which tests the wettability of solder paste and components while simulating the SMT mounting and reflow process. The SP2 simulates the actual
temperature that solder paste under- goes during preheat and reflow, let- ting the user easily identify any defi- ciencies in flux activity or component wettability. The system measures solder paste, component, and PCB wettability, wettability on tempera- ture rise, and wettability on preheat- ing time. By simulation of the SMT mounting and reflow process with standard variables, it is possible to
Malcom SP-2 wetting tester.
develop an accurate, repeatable eval- uation method to determine a solder paste’s solderability. The SP-2 complies with ANSI J-
STD-003, MIL-STD 883, ISO 9455- 16 and JIS Z 3198. It tests the wetta- bility of solder paste, component lead, and PCB substrate landings. The system is capable of measuring miniaturized components and con- tains a built-in heater that can be adjusted for optimum reflow or max-
imum wetting. Contact: Seika Machinery, Inc.,
3528 Torrance Boulevard, Suite 100, Torrance, CA 90503 % 310-540-7310 fax: 310-540-7930 E-mail:
info@seikausa.com Web:
www.seikausa.com
See at SMTAI, Booth 506
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