Equipment and Materials ♦ news digest
The following resolutions were also approved at Aixtron’s 14th Annual General Meeting:
Dividend payment of 60 Euro-Cents per share for fiscal year 201
Approval of the activities of the members of the Executive Board and of the Supervisory Board during fiscal year 2010
Remuneration of the first and the new Supervisory Board of Aixtron SE
Election of the auditors and the Group auditors for fiscal year 2011
Creation of new Authorised Capital 2011
About 49 percent of Aixtron SE’s share capital was represented at the shareholder meeting held at the Eurogress in Aachen, Germany.
The Supervisory and Executive Board speeches given during the meeting were broadcast live via the internet, and are now available as webcasts under (
www.aixtron.com/agm). The speaker notes and the slides to the presentation to Topic 1 of the agenda are also available for download from the website.
Nanotronics “Point and Shoot” technology ideal for CS defect characterisation
The flexible system images defects on 2” to 8” wafers and aims to eliminate a learning curve for users, whilst providing accurate and easy to interpret data.
Nanotronics Imaging introduced its nSPEC semiconductor analysis system at the CS Mantech show in Palm Springs, California.
The proprietary software and hardware underlying nSPEC enable rapid and detailed analysis of wafer defects and are particularly suited to compound semiconductor wafers.
Complete system automation with cassette-to- cassette loading of 2”-8” wafers is also available. Nanotronics uses “Point and Shoot” microscopy, and aims to eliminate a learning curve for users, while giving accurate and easy to interpret data.
Nanotronics Imaging has also appointed a new Vice President Ivan Eliashevich, who brings a level of expertise in the semiconductor industry that is unique. “I knew Ivan as a client, who helped me to understand wafer technology. He is honest, knowledgeable, and a powerful proponent for the customer and supplier. I feel lucky to have him as a part of our team”, says CEO and founder Matthew Putman.
Oxford wins multiple etch system order from GCS
GCS chose Oxford because its ICP etchers offer a combination of process capability, consistency, value and diversity to process a variety of compound semiconductor materials, including GaAs, InP and GaN to achieve the desired device performance.
Etch, deposition and growth systems manufacturer Oxford Instruments has received an order from Global Communication Semiconductors (GCS) for multiple PlasmaPro System100 ICP 180 etch systems.
October 2011
www.compoundsemiconductor.net 191
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