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RF Electronics ♦ news digest


integrated front-to-back product design flow with customised DRC and LVS solutions. This offers the design engineer a unified suite of EDA software for schematic capture, simulation, layout, and layout verification.


“We have upgraded our PDKs utilising the new ADS 2011 capabilities in order to provide continued superior design support for our mutual customers and to our in-house product designers,” said Glen Riley, vice president of TriQuint’s Commercial Foundry Business Unit.


TriQuint has also expanded ADS deployment for an integrated RF Module design flow. Further collaboration between the companies led to the validation and deployment of an ADS RF Module PDK within TriQuint that integrates multi-technology IC and RF Module layout features, providing a complete electrical and physical RF Module design flow.


The integrated module design flow removes design translation errors, shortens product development cycle times and enables design optimisation for module product manufacturing yield, thus reducing overall engineering and development expenses.


“We are very pleased to announce these new developments in our collaboration with TriQuint,” said Mark Pierpoint, vice president of Agilent EEsof EDA. “Our best engineers have been working together, and the improved productivity and ability to optimise today’s complex MMIC/ RFIC module design flow is exactly what we had hoped to achieve when we started the development of ADS 2011. It is great to see both TriQuint and their customers benefit from our joint engineering investments.”


The leading electronic design automation software for RF, microwave and signal integrity applications, ADS pioneers the most innovative and commercially successful technologies, such as X-parameters and 3-D electromagnetic simulators.


ADS 2011 addresses the most challenging design complexity and integration needs of leading-edge commercial wireless and aerospace/defence companies, by enabling them to design multi- technology RF system-in-package modules and perform complex electromagnetic simulations -all with greater ease and speed.


Agilent EEsof EDA is the leading supplier of electronic design automation software for microwave, RF, high-frequency, high-speed digital, RF system, electronic system level, circuit, 3-D electromagnetic, physical design and device- modelling applications.


Wafer Bonding Report


Yole Développement announces the publication of its technology study and market research report, Permanent wafer bonding report


Historically developed for MEMS & SOI substrates, the wafer bonding technology is today becoming a key processing technology for a wide range of applications including LEDs, Power Devices, RF and Advanced Packaging.


The wafer bonding market is a very complex one crossing different wafer sizes (from 2’’ to 12’’), different applications (Advanced Substrates such as SOI, MEMS, LEDs, CMOS Image Sensors, Power Devices, RF Devices & Advanced Packaging) and different bonding technologies (Adhesive, Anodic, Fusion, Direct Oxide, Eutectic, Glass Frit, Metal Diffusion).


Yole Développement’s report aims at giving a vision, crossing what the wafer bonding technologies will be over the 2010-2016 time line.


Market Trends


Wafer bonding is usually defined as a process that temporarily or permanently joins two wafers or substrates using a suitable process. Historically developed for MEMS and then SOI wafers, wafer bonding technology has shifted to non-mainstream IC applications over the last years. Our report aims at analyzing the market perspectives and technical trends for permanent bonding.


Wafer bonder can be also used for LEDs or Power Devices. Indeed, in a typical LED active region, spontaneous emission scatters photons in all directions. If the substrate material has a smaller band gap than the active region, approximately half of the light is absorbed in the substrate; significantly reducing device performance. So, one of the manufacturing solutions for photon loss involves


October 2011 www.compoundsemiconductor.net 127


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