news digest ♦ RF Electronics
bonding a wafer containing an array of devices to another wafer that provides both a reflective surface for maximum light extraction and a heat sink for thermal management. And of course, over the 5 past years, much attention has been given to this technology for 3D integration of memories for example.
Technology Trends
Yole Développement has estimated the wafer bonder to have big market growth for the next year. The growth will be driven small size wafer for LEDs and 12” wafer for 3D stacking and CIS.
Although EV Group is market leader in permanent bonding, the growth of the bonding equipment market is attracting challengers.
founder of Yole Développement, a market research company based in France. At Yole Développement, Dr. Eric Mounier is in charge of market analysis for MEMS, equipment & material.
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Catalogue price: Euros 3,990.00 (single user license) - Publication date: May 2011
For special offers and the price in dollars, please contact David Jourdan (
jourdan@yole.fr or +33 472 83 01 90)
• Companies cited in the report
Acreo, AML, APM/UMC, Avago, Ayumi, Bosch, Colibrys, Dalsa, Discera, EVGroup, FhG IMS, FLIR, IBM, Icemos, IMEC, IMT, Infineon, Infineon, Invensense, KTH, Leti, Lumileds, MEMStech, Micralyne, Mitsubishi Heavy Industries, Okmetic, Omron, Osram, Qualcomm, Raytheon, RPI, Sand9, Semefab, Sensonor, Silex, SOITEC, STM, SUSS MicroTEC, Tezzaron, TI, tMt, Tohoku University, TowerJazz, Tracit, Triquint, Tronic’s, TSMC, VTI, Xcom, Ziptronix
Skyworks spreads its wings with acquisition of SiGe Semiconductor
Yole Développement’s report analyzes in details the technical & economical evolution of the permanent wafer bonding process. It gives, for example, 2010- 2016 market forecasts for permanent bonding, number of equipment, an overview of the different bonding approaches and equipment players market shares and competitive information
This market & technology report also presents the trends for permanent bonding, W2W vs. C2W analysis for 3D integration. It describes the applications for wafer bonding with main characteristics, challenges
About Permanent Wafer Bonding Report: •
Authors
Dr. Eric Mounier has a PhD in microelectronics from the INPG in Grenoble. Since 1998 he is a co-
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www.compoundsemiconductor.net October 2011
With this move Skyworks immediately expands its market which will now broaden opportunities in the smart phones, tablets, gaming consoles, notebook PCs and home automation systems markets.
Skyworks Solutions, an innovator of high reliability analogue and mixed signal semiconductors enabling a broad range of end markets, has signed a definitive agreement to purchase SiGe Semiconductor.
SiGe Semiconductor is a global supplier of RF front-end solutions that are facilitating wireless multimedia across a wide range of applications.
The acquisition of SiGe, a fabless semiconductor provider, complements Skyworks’ leadership in wide area front-end solutions by adding SiGe’s innovative short range, silicon-based products. As a result, Skyworks will be able to offer customers a comprehensive wireless networking product
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