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3rd CS International Conference
Gain a comprehensive overview of the entire compound semiconductor industry-the must attend event for 2013 is the 3rd
Sheraton Frankfurt on 4th
CS International conference in Germany, at the -5th
March 2013.
Delegates will have the unique opportunity to network with leading industry professionals of the III-V chip making industry, interact with suppliers and industry experts who will deliver the latest research, business models, and insights.
Speakers
Dr Simon Fafard Chief Technical Officer, Cyrium Technologies Novel Solar Cell Technology
Dr Markus Behet Global Market Segment Manager Electronics Solutions, Dow Corning Corporation Large Diameter SiC and GaN/Si Substrates for Power Electronic Applications
Dr Schang-jing Hon Associate Vice President, Epistar Corporation High-Voltage LED Technology in 2013
Daniel Cline Senior Analyst, Lux Research WBG Devices’ Electricity Grid Opportunity
Dr Tudor Williams Senior Systems Engineer, Mesuro Ltd Improving RF Measurements
Gunnar Stolze Vice President, Sales, Industrial and Consumer, Oclaro Inc High Power Lasers
Speaker TBC Panasonic Europe Dry Etching Technology for Power Devices
AJ Nadler General Manager, Research Development and Engineering, RF Micro Devices (RFMD) Gallium Nitride for High Voltage Power Electronics
Professor Tao Wang Scientific Advisor, Seren Photonics Improving LED Performance
Dr Rainer Krause Director Smart Cell Incubator Unit, Soitec PV Chip Development
Dr Vijit Sabnis Vice President Technology, Solar Junction Really High Efficiency Triple-junction Solar Cells
Asif Anwar Director Strategic Technologies Practice, Strategy Analytics The Future of GaAs Microelectronic Manufacturing
Dr Michael Lebby General Manager & Chief Technology Officer, Translucent Inc On-silicon Platform for Economies of Scale in LEDs, Power FETs, and Solar CPV
Dr Yifeng Wu Vice President, Product Development, Transphorm Status of Wide Bandgap Power Electronics
Bryan Bothwell Strategy & Business Development, TriQuint Semiconductor Maximizing Gallium Nitride Product Solutions and Foundry Services for Advanced RF Design Success
Dr Philippe Roussel Business Unit Manager, Yole Developpment GaN vs. SiC in Power Electronics-Status and Roadmap to 2020
Dr Frank Schulte Vice President, Aixtron Presentation TBC
Dr Ertugrul Sönmez Business Development, MicroGaN Addressing Emerging Power Market
Speaker TBC Evatec Presentation TBC
All speakers, presentations and timings are subject to change Platinum Sponsors Conference Chair
Keynote Speaker Dr Andrew Nelson, IQE
President and Chief Executive Officer
Dr Wilman Tsai, Intel Corporation Program Manager of Technology Manufacturing Group III-V CMOS
Gold Sponsors
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