This page contains a Flash digital edition of a book.
wireless  industry


components and configurations needed to cover the required transmit bands and modulations (see Figure 5). Many alternatives are inferior, because they solve similar problems with techniques that potentially add to the cost and complexity of each component.


We can illustrate this point with a block diagram of an ET design that we have put together. (see Figure 5). Further improvements in high-power efficiency may result from adding pre-distortion – this could increase high-power efficiency by allowing the PA to operate closer to compression (see Figure 3 for an example of how this can increase system efficiency).


However, effective, high-bandwidth envelope tracking demands a DC-DC converter that is capable of delivering the rapid, accurate changes in voltage required to follow the envelope of high PAR modulations. Unfortunately, gains in PA efficiency resulting from this approach are offset by declines in the conversion efficiency of the ET DC-DC converter and the circuitry needed to rapidly follow the modulation envelope (operating at a wider bandwidth reduces the converter efficiency). The good news, however, is that the system ‘up-lift’ is favourable. In other words, the PA efficiency improvement, minus the ‘cost’ of the ET implementation circuitry, is beneficial rather than detrimental.


As transmit power is lowered, a point can be reached where the PA benefit is effectively cancelled by the conversion efficiency of the ET circuitry. When this happens, the efficiency enhancement method must be changed for optimum performance. Several options are available: Switching the system to an APT mode with greater DC-DC conversion efficiencies; adjusting PA bias, or using similar low-power efficiency enhancement techniques; or adopting optimum combinations of these techniques, which come together to ensure high- efficiency transmit operation over the full range of conditions.


Bringing it all together We believe that these new generations of RF platforms will require closer co-ordination of transceiver, power management and power-amplifier blocks. These latest designs must also be capable of handling complex communication, as well as timing signals to ensure proper operation with the transceiver – there needs to be a seamless, well executed transition between the various efficiency enhancement techniques providing transmit operation over a wide range of modulations, frequencies and power levels. Desirable qualities from the power management include rapid, accurate changes in voltage capable of following a high PAR envelope if ET is used, plus the prevention of excessive switching noise, preservation of spectral purity and maintenance of sufficiently high power conversion efficiencies to reap the rewards of this approach.


Additionally, the PA must be designed with the optimum load line for operation across the dynamic range. This implies proper device scaling, and careful trade-offs, such as judicious selection of the supply capacitance so that the smart device fulfils the complex requirements of the wireless network.


It is clear that for the foreseeable future, consumer demand for mobility and high data rate connectivity in smart devices will continue to drive complexity and challenges in the RF front-end market. In response, engineers will continue to improve and optimise the energy usage, thermal performance and battery life of modern data devices through innovation in the individual components, as well as integration of these components into a cohesive RF platform.


© 2012 Angel Business Communications. Permission required.


Figure 4. A graphic


representation of the PAE improvements for several enhancement methods, neglecting conversion efficiency


associated with implementation


Figure 5.


A representation of an RF front end showing PA power management (DC-DC


converter) to multiple PA components


July 2012 www.compoundsemiconductor.net 29


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100  |  Page 101  |  Page 102  |  Page 103  |  Page 104  |  Page 105  |  Page 106  |  Page 107  |  Page 108  |  Page 109  |  Page 110  |  Page 111  |  Page 112  |  Page 113  |  Page 114  |  Page 115  |  Page 116  |  Page 117  |  Page 118  |  Page 119  |  Page 120  |  Page 121  |  Page 122  |  Page 123  |  Page 124  |  Page 125  |  Page 126  |  Page 127  |  Page 128  |  Page 129  |  Page 130  |  Page 131  |  Page 132  |  Page 133  |  Page 134  |  Page 135  |  Page 136  |  Page 137  |  Page 138  |  Page 139  |  Page 140  |  Page 141  |  Page 142  |  Page 143  |  Page 144  |  Page 145  |  Page 146  |  Page 147  |  Page 148  |  Page 149  |  Page 150  |  Page 151  |  Page 152  |  Page 153  |  Page 154  |  Page 155  |  Page 156  |  Page 157  |  Page 158  |  Page 159  |  Page 160  |  Page 161  |  Page 162  |  Page 163  |  Page 164  |  Page 165  |  Page 166  |  Page 167  |  Page 168  |  Page 169  |  Page 170  |  Page 171  |  Page 172  |  Page 173  |  Page 174  |  Page 175  |  Page 176  |  Page 177  |  Page 178  |  Page 179  |  Page 180  |  Page 181  |  Page 182  |  Page 183  |  Page 184  |  Page 185  |  Page 186