news digest ♦ Telecoms
Foundry Services Vice President and General Manager, James L. Klein.
TriQuint has also revealed three new GaN power amplifiers that deliver greater efficiency, wideband coverage and excellent performance for communications, defence and civilian radar. These are the TGA2572-FL (14-16 GHz), now available; as well as the TGA2579-FL (14-15.5 GHz) and the TGA2593-GSG (13-15 GHz), which will be available in July.
The TriConnect TQP6M9017 utilises TriQuint’s E/D pHEMT and HBT technologies to integrate active and passive components into a compact, high-performance module. The E/D pHEMT has an InGaAs active layer.
In addition to supporting faster download speeds, TriQuint’s TriConnect TQP6M9017 high- performance WLAN module improves the wireless experience by enabling connectivity from greater distances; it allows nearly 60% further range than its predecessor, the TQP6M9002, thanks to advances in output power technology.
TriQuint is also announcing the availability of the T1G6003028-FS, a 30W wideband GaN packaged transistor that can cut the number of driver circuits in a typical power amplifier design by 50%.
First ever 802.11ac Wi-Fi RF module released by TriQuint
The device, suited for next-generation smartphones and tablets, enables greater range and performance for video streaming. It employs the firm’s E/D pHEMT technology which incorporates an indium gallium arsenide active layer
TriQuint Semiconductor has introduced what it says is the industry’s first 802.11ac Wi-Fi RF module for next-generation mobile devices.
As demand for Wi-Fi proliferates worldwide, consumers have developed an ever-growing appetite for faster mobile data rates to support video streaming and other multimedia applications. With data rates up to 1.3 gigabits per second, the new IEEE 802.11ac standard will deliver transfer rates three to four times faster than current- generation 802.11n Wi-Fi. In-Stat predicts one billion devices with 802.11ac technology will ship by 2015.
“TriQuint is at the forefront of technology with the first 802.11ac-ready module for mobile devices. A major manufacturer has selected our new high- performance TriConnect component for its next- generation smartphone, and it’s also included on a reference design by a leading chipset supplier,” says Shane Smith, Vice President of Global Marketing for Mobile Devices at TriQuint. “Our 802.11ac technology expertise also expands our future market opportunity for infotainment applications such as in-home video distribution.”
The TriConnect TQP6M9017 is a highly integrated, dual-band WLAN module that provides a complete solution for 802.11 a/b/g/n/ac Wi-Fi and Bluetooth applications, thus simplifying RF design for device manufacturers. It integrates two power amplifiers for the 2.4 and 5 GHz frequency bands with a switch,
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www.compoundsemiconductor.net July 2012
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