news review
Silicon substrate LED arrays delivering best thermal dissipation performance
KOREAN spin-off, Daewon Innost has revealed the “Glaxum” LED Array family of Chip-On Board modules. Using proprietary Nano-Pore Silicon Substrate (NPSS) technology, Glaxum arrays are claimed to provide the industry’s best thermal dissipation performance with thermal impedance of only 0.410C / W. They are built using some of the highest efficacy, commercially available 1 WLED chips.
Daewon Innost developed the NPSS technology for LED modules specifically to provide the best thermal dissipation performance available today.
The LED substrate is created by applying semiconductor lithography to silicon wafers allowing for fine pitch
interconnection between GaN LED chips, providing a pitch spacing of 50 µm as
compared to over 300 µm with current Metal Core Printed Circuit Board (MCPCB). NPSS offers several advantages over MCPCB including superior thermal performance, higher levels of integration, and favourable scaling which will offer lower system costs as power levels increase.
“We are delighted with the test results of our LED modules as independently tested by a leading LED chip supplier. The results demonstrate that we have surpassed the thermal performance of the best performing chip on board (COB) technology to date,” says Sungyuk ‘Stephen’ Won, CEO of Daewon Innost.
“Our Glaxum module runs over 12 degrees centigrade cooler than the previous top performing COB module. The
Lattice Power first to volume production of high-power GaN-on-Si LEDs
LATTICE POWER CORPORATION has announced the start of volume production of its new generation GaN-based high powered LEDs on silicon substrates.
Lattice Power claims to be the first and only company in volume production of GaN-on-Silicon LED chips, with products that are comparable to high-end chips that rely on conventional sapphire substrates.
Operating at a current of 350mA, the 45 mm product is capable of producing 130 lumen cool white with an efficiency of 120 lumens for each watt consumed. What’s more, silicon substrates are readily available in larger diameters and come at a fraction of the cost of sapphire substrates resulting in substantial cost reductions for downstream manufacturers.
Twenty strategic customers have received the LEDs and will incorporate them into indoor and outdoor lighting applications.
Lattice Power’s silicon LED series encompasses four different chip sizes. Chip power ranges from 0.5W to 2W.
10
www.compoundsemiconductor.net July 2012
Lattice Power has always invested heavily in research and development in silicon substrate-based LED technology. The commercialisation of its silicon substrate based power chip series represents a second milestone for Lattice Power after the launch and volume production of its smaller size silicon substrate-based LED chips used in display and signage.
Using GaN-on-Silicon technology to make commercial grade LEDs in the United States and Europe has shown promising laboratory results.
While moving towards mass production, Lattice Power says it has filed more than 200 innovative international and domestic patents in this field.
“Lattice Power not only has the state-of- the-art silicon substrate-based LED technology, but also a world class technical and management team,” says Sonny Wu, the managing director of GSR Ventures and chairman of Lattice Power. “With the big growth of solid state lighting and Lattice Power’s introduction of high
industry rule of thumb is that each degree centigrade you can lower operating temperature translates to an extra 1000 hours of lifetime, so our cooler temperatures will provide longer life for LED arrays.”
“Our business success directly depends on the reliability of our products, and thermal performance is critical for lumen maintenance. AlterLume sees the introduction of Daewon Innost’s NPSS array packages as a seminal moment in LED lighting technology, and we are proud to be part of its advance in both technology improvements and cost reduction,” concludes Brent.
power LED product family into the lighting market, the company has once again proven its cutting-edge development and manufacturing capabilities. I’m highly confident that Lattice Power will grow into a world class solid state lighting company.”
“Since its birth, Lattice Power has focused on high efficiency, low cost and high reliability LEDs on silicon. To get to where it is now, Lattice Power has faced lots of hurdles and challenges and overcome many obstacles and heart-breaks,” adds Wang Min, the co-founder and CEO of Lattice Power. “But we have persevered and gained enormous traction with customers. Our silicon-based LED technology will finally open the door for LED bulbs to be used in millions of households.”
Leading industry experts now predict that future LED chip cost savings could be as much as 70% greater than with the current mainstream products when manufactured on larger diameter silicon substrates.
Lattice Power is actively working on 150mm GaN-on-silicon technology and is expecting to transfer its production to even larger diameter silicon substrates in 2013.
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116 |
Page 117 |
Page 118 |
Page 119 |
Page 120 |
Page 121 |
Page 122 |
Page 123 |
Page 124 |
Page 125 |
Page 126 |
Page 127 |
Page 128 |
Page 129 |
Page 130 |
Page 131 |
Page 132 |
Page 133 |
Page 134 |
Page 135 |
Page 136 |
Page 137 |
Page 138 |
Page 139 |
Page 140 |
Page 141 |
Page 142 |
Page 143 |
Page 144 |
Page 145 |
Page 146 |
Page 147 |
Page 148 |
Page 149 |
Page 150 |
Page 151 |
Page 152 |
Page 153 |
Page 154 |
Page 155 |
Page 156 |
Page 157 |
Page 158 |
Page 159 |
Page 160 |
Page 161 |
Page 162 |
Page 163 |
Page 164 |
Page 165 |
Page 166 |
Page 167 |
Page 168 |
Page 169 |
Page 170 |
Page 171 |
Page 172 |
Page 173 |
Page 174 |
Page 175 |
Page 176 |
Page 177 |
Page 178 |
Page 179 |
Page 180 |
Page 181 |
Page 182 |
Page 183 |
Page 184 |
Page 185 |
Page 186