news review NXP enhance GPS signal reception
NXP SEMICONDUCTORS N.V. has unveiled the BGU8006 low-noise amplifier. The firm reckons it is the tiniest GPS LNA on the market today designed for very small portable devices.
Available in a compact WLCSP (wafer-level chip-scale package), measuring just 0.65 x 0.44 x 0.2mm, the latest GPS LNAs require only two external components, saving 38 percent in PCB space compared to what NXP says is the smallest solution on the market today.
Also featuring an extremely low noise figure of 0.60 dB, the LNAs offer superb reception for weak GPS signals by dynamically suppressing strong cellular and WLAN transmit signals.
“Smartphones, tablets, personal navigation devices and automotive telematics applications all suffer from communication delays when network reception is poor, and have to wait for data to refresh as the GPS searches for satellite signal. Our new BGU8006 LNA helps to maintain optimal GPS signal reception for as long as possible – on a chip that is so small, it isn’t even visible to the naked eye,” explains Erick Olsen, marketing director, RF small signal product line, NXP Semiconductors. “As GPS functionality becomes ubiquitous, the ability to deliver better accuracy and faster Time to First Fix will vastly improve user experience and enable operators to provide more sophisticated Location Based Services down the line,” he continues.
The new BGU8006 LNA uses adaptive biasing techniques – enabled by NXP’s QuBIC4Xi SiGe:C BiCMOS process technology – to instantly detect any output power from jammers, and compensate by temporarily increasing the current. Adaptive biasing dynamically suppresses strong cellular, WLAN and Bluetooth signals, which can drive typical GPS LNAs into compression, lowering gain, generating intermodulation and harmonics that can overpower weak signals, and causing poor GPS reception. With the BGU8006, adaptive biasing improves linearity with a 10 dB better IP3 under -40 to -20 dBm jamming conditions and provides effective GPS output with jammer power up to -15 dBm.
The BGU8006 LNA uses wafer-level chip- July 2012
www.compoundsemiconductor.net 13
scale package (WLCSP) technology, which is ideal for space-constrained applications. WLCSP minimises parasitic inductance because there are no leads, bond wires or interposer connections, and optimises package size, cost and thermal characteristics. In addition to the BGU8006, NXP also offers the BGU8007 LNA in a 1.45 x 1.0 x 0.5 mm 6-pin
leadless SOT886 package. Both LNAs require only one external matching inductor and one external decoupling capacitor for easy design-in and savings in component costs and PCB area.
NXP’s BGU800x series LNAs are ideally suited for a wide range of applications using GPS technology.
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116 |
Page 117 |
Page 118 |
Page 119 |
Page 120 |
Page 121 |
Page 122 |
Page 123 |
Page 124 |
Page 125 |
Page 126 |
Page 127 |
Page 128 |
Page 129 |
Page 130 |
Page 131 |
Page 132 |
Page 133 |
Page 134 |
Page 135 |
Page 136 |
Page 137 |
Page 138 |
Page 139 |
Page 140 |
Page 141 |
Page 142 |
Page 143 |
Page 144 |
Page 145 |
Page 146 |
Page 147 |
Page 148 |
Page 149 |
Page 150 |
Page 151 |
Page 152 |
Page 153 |
Page 154 |
Page 155 |
Page 156 |
Page 157 |
Page 158 |
Page 159 |
Page 160 |
Page 161 |
Page 162 |
Page 163 |
Page 164 |
Page 165 |
Page 166 |
Page 167 |
Page 168 |
Page 169 |
Page 170 |
Page 171 |
Page 172 |
Page 173 |
Page 174 |
Page 175 |
Page 176 |
Page 177 |
Page 178 |
Page 179 |
Page 180 |
Page 181 |
Page 182 |
Page 183 |
Page 184 |
Page 185 |
Page 186