October, 2017


Cambridge, MA — Cicor’s new technology plat- form, DenciTec®, enables a high density of inte- grated functions for PCBs. In microelectronics, the boundaries between thin film and printed cir- cuit technologies are becoming increasingly blurred. Thin film technology works with materi- als, processes and machines from both fields. Cicor offers PCB and thin film manufacturing under one roof. Standard methods used today, such as panel


and pattern plating, deliver good results, with con- ductor widths and spacings down to 50 µm. Where structures are smaller, the limitations of today’s production processes make it impossible to exploit the full potential of the latest connection technolo- gies. These include via stacking, via-in-pad struc- tures and integrated antennas. With semi-additive processes using thin film


technology, for instance, conductor widths and spacings of less than 15 µm are possible. However, this technology is usually limited to


Lista Creates Space-Saving Shelf Converter


Allentown, PA — Boosting productiv- ity and maximum storage, the new Lista Shelf Converter® System trans- forms ordinary shelving into an effi- cient, high-density storage solution. Adjustable shelves, drawers, and trays convert existing shelving into customized storage to best fit every- day storage needs. Compatible with multiple industry-leading shelving manufacturers, the system is designed to make updating storage capabilities easy. Designed to help health care,


manufacturing, automotive, mainte- nance and repair, and assembly com- panies become more efficient, the shelf converter storage system has


Miniaturized circuit created with DenciTec.


www.us-tech.com


expensive production processes. It is possible for this technology to be upscaled, but this is extreme- ly complicated and comes at a high cost.


Page 99 Cicor’s DenciTec Enables Further PCB Miniaturization The new DenciTec platform from Cicor


enables the production of circuits with extremely high density, without the disadvantages of today’s established manufacturing processes. Possibilities include conductor widths and spacings down to 25 µm with copper thicknesses of 20 µm, ±5 on all con- ductive layers, laser-via diameters of 35 µm, annu- lar rings with a diameter of 30 µm for the inner layers and 20 µm for the outer layers, copper-filled blind vias with the option of via stacking, and vias in pads. The use of advanced materials allows the production of ultra-thin circuits, including the manufacture of four-layer flex circuits with a total


thickness of less than 120 µm. Contact: Cicor Americas, Inc., 185 Alewife


Brook Parkway, Suite 410, Cambridge, MA 02138 % 617-576-2005 E-mail: info-americas@cicor.com


Web: www.cicor.com See at productronica, Hall B3 Booth 560


Converter for industry-standard shelves.


an all-new 18 in. (45.7 cm) deep sys- tem of drawers, in addition to the existing 24 in. (61 cm) depth. Drawer heights range from 3 to


8 in. (7.6 to 20.3 cm) and offer both 200 and 400 lb (90.7 and 181.4 kg) drawer capacity solutions. The draw- ers’ capacity has been increased by 30 percent over previous models. The added shelf converter draw-


ers are ideal for storing small parts, making inventory easier to locate, pick, and manage. All recessed draw- ers extend fully to easily access items in the furthest corners, while a 400 lb (181.4 kg) capacity roll-out tray pro-


vides a solution for large, bulky items. Contact: Lista International


Corp., 106 Lowland Street,


Holliston, MA 01746 % 508-429-1350 fax: 508-626-0353 E-mail: info@listaintl.com Web: www.listaintl.com


See at The ASSEMBLY Show, Booth 1431


See at productronica, Hall A2 Booth 361


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