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Vista, CA — Nordson Test & Inspection, made up of DAGE, MATRIX and YESTECH, is display- ing a full lineup of inspection sys- tems at productronica 2017. These include the Quadra™ 7 and Quadra 5 X-ray inspection systems, the new XS series in-line X-ray inspection platform complemented by the X#
www.us-tech.com The DAGE 4800 advanced auto-
mated wafer testing bondtester is designed for the testing of 7.9 to 17.7 in. (200 to 450 mm) wafers. A range of powerful camera and optical sys- tems optimize load tool alignment. The system also includes auto-pro- gramming and post-test analysis. The 4000Plus bondtester, with
camera assist automation, is designed for pull-and-shear testing of wafer interconnections, lead frames, hybrid microcircuits, or automotive electronic packages. Nordson MATRIX has intro-
Nordson MATRIX XCT-1000 X-ray inspection system.
series and XCT-1000, as well as the FX-940 ULTRA 3D AOI system. On the bondtester side, the com-
pany is demonstrating its 4800, con- figured for ball shear on a 11.8 in. (300 mm) wafer, along with a 4000Plus bondtester configured for battery testing. Nordson DAGE’s flagship sys-
tem, the Quadra 7 is the company’s most cutting-edge inspection machine. Ultra-high-quality 6.7 MP images are displayed at 1:1 resolution over two 4K monitors. The Quadra 5 offers high performance and ease of use for 2D and 3D X-ray applications. For PCB and semiconductor
package inspection, the system pro- vides 0.35 µm feature recognition with up to 10W of power.
duced its XS series, a high-speed, automated, in-line X-ray inspection platform. The system is designed for small and medium board sizes and targets automotive and backend semiconductor applications. The XS series provides 2D, 2.5D and 3D X- ray inspection of PCB assemblies, samples in trays and hybrid applica- tions. A newly-designed sample table and state-of-the-art linear-driven detector motion system offers excel- lent 2.5D and 3D imaging speeds. The X# series is the most flexi-
ble AXI platform series in the MATRIX product portfolio. The sys- tem is available with two different handling modes and is equipped with a verification terminal at its output. The embedded barcode scanning gantry provides automated scanning of product barcodes. With the X2.5# high-power setup, MATRIX presents a sustainable solution for the inspec- tion of power hybrid applications (IGBTs), which has become a demanding requirement in the auto- motive industry. The XCT-1000 complements the
existing AXI portfolio with CT tech- nology. This platform is especially
suitable for the inspection of small- to-medium production volumes, sam- ple tests or for use in laboratory envi- ronments. The Nordson YESTECH FX-940
ULTRA 3D AOI is designed for the inspection of solder defects, lead defects/lifted leads, component pres- ence/absence detection, and copla- narity inspection. With its advanced fusion lighting and comprehensive inspection tools, including angled
October, 2017 Nordson Test Lines Up Automated Inspection Systems
cameras, full-color digital image pro- cessing, and both image- and rule- based algorithms, the system offers
excellent 2D and 3D defect detection. Contact: Nordson DAGE, 2370
Oakridge Way, Suite B, Vista, CA 92081 % 510-683-3930 E-mail:
sales@nordsondage.com Web:
www.nordson.com
See at productronica, Hall A2 Booth 445
Vi Technology Combines 3D AOI and SPI
Richardson, TX — Vi Technology is presenting the latest innovations from its product line. These include the 5K3D AOI and PI 3D SPI sys- tems. By coupling these two measure- ment systems, the company’s Sigma Line module offers a real-time combination of 3D SPI and 3D AOI inspection measurements. By considering all
inspection systems as a single tool, the result is a new way to optimize the SMT process and move toward zero defects. It is also the prerequisite to trans- forming large volumes of raw data into actionable items. The 5K3D is a new patented 3D
gramming-free software and accuracy for small pads. Reportedly, the series offers the only inspection systems that program automatically. With 360° moiré technology, the systems
PI series 3D component rendering. provide an extra-large 3D image for
AOI combination that offers complete defect coverage with high-precision metrology. The 5K3D is a 100 percent 3D AOI, based on laser technology with angled cameras. It offers a wide range of z-measurement, up to 1 in. (25 mm), while maintaining high accuracy and speed. The PI series 3D SPI offers pro-
review interface and accuracy. Contact: Vi Technology, Inc., 903 N Bowser Road, Suite 202,
Richardson, TX 75081 % 972-235-1170 E-mail:
sales.americas@
vitechnology.com Web:
www.vitechnology.com
See at productronica, Hall A2 Booth 421
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