October, 2017
www.us-tech.com
Weidmuller Adds New Remote IO-Link Masters
Richmond, VA — Weidmuller has expanded its u-remote Remote I/O product portfolio with two new IO- Link master modules — IP20 and IP67. These new IO-Link master modules use the IO-Link open stan- dard (IEC 61131-9) serial communi- cation protocol to communicate data to and from sensors and actuators. This increased transparency down to the sensor-actuator level helps improve diagnostics and efficiency, increase machine availability, and reduce downtime.
faster service response in the event of unplanned downtime. The IP20 master module has an
increased power supply, compared with currently-available IO-Link modules. It offers 500 mA per I/O channel (type A), rather than 200 mA. The IP67 master module is
designed for installation in the field as a communication interface to the sen- sors and actuators. At 1.2 in. (30 mm) wide, it contains four type A and four type B ports, all of which may be con- figured as an input or output. The
Page 115
IP20 IO-Link master module. The new modules have simple,
user-friendly, web-based configura- tion and monitoring. This allows users to conveniently change param- eters using the web server, and pro- vides both on-site and remote testing and diagnostics, without the need for additional software. Processes and procedures can be simulated without a connection to the controller for sim- plified phase commissioning and
type B ports enable the connection of actuators up to 2A. Users can increase the feed-in to the I/O system to 16A, reducing the wiring requirements, and the L-coded plugs supply
increased power to the system. Contact: Weidmuller, 821
Southlake Boulevard, Richmond, VA 23236 % 800-849-9343 fax: 804-379- 2593 E-mail:
ssikes@weidmuller.com Web:
www.weidmuller.com
Tech-Etch Offers Photo-Etching Brochure
Plymouth, MA — Tech-Etch has released a technical brochure that describes the company’s photo-etching capabilities for thin metal parts, board-level shielding and flexible cir- cuits. The company has the flexibility to produce prototype quantities and large production runs of intricate
sion parts. Applications include encoders, masks, filters, lead frames, flat springs, strain gauges, lamina- tions, step covers, heat sinks, shields, shims, cathodes, and fuel cell plates. Tech-Etch uses photo-etching
for many medical device component- level parts, such as maxillofacial and cranial titanium reconstruction implants, anode and cathode grids for battery technologies that support implanted medical devices, tungsten opaque components for X-ray devices, blanks for surgical blades, and stiffener bands for valve replace- ment.
Metals such as beryllium cop-
per, stainless steel, aluminum alloys, titanium, tungsten, nitinol, molybde- num, brass and spring steels can be etched. Photo-etching is also used to make flat parts from polyimide film for non-conductive washers, screens, gaskets, and insulation layers. Parts range in thickness from
Tech-Etch photo-etching capabilities brochure.
parts. These parts are then used in a wide variety of mechanical and electri- cal applications, without the high cost and long lead times of hard tooling. Custom light-gauge parts are
repeatably produced with intricate patterns, precise tolerances and burr-free edges. The brochure con- tains photographs of over 100 preci-
0.0005 to 0.03 in. (0.013 to 0.76 mm). Laser machining is offered for thick- er parts, from 0.03 to 0.125 in. (0.76 to 3.17 mm), and is also used for pre- cision drilling and ablating the poly- imide laminates used in flexible cir- cuits. Special processes, such as forming, laminating, heat treatment, assembly, and finishing, are all
available in-house. Contact: Tech-Etch, Inc., 45
Aldrin Road, Plymouth, MA 02360 % 508-747-0300
E-mail:
sales@tech-etch.com Web:
www.tech-etch.com
See at MD&M Minneapolis, Booth 1437
RoHS
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116 |
Page 117 |
Page 118 |
Page 119 |
Page 120 |
Page 121 |
Page 122 |
Page 123 |
Page 124
