October, 2017
www.us-tech.com
Page 107 K&S Intros Hybrid Wafer Feeder
Fort Washington, PA — Kulicke & Soffa’s hybrid wafer feeder combines fast, high-end flip chip bonding with high-speed chip shooting for SiP (sys- tem-in-package) manufacturing. The system places flip chips at up to 27,000 cph (IPC), passive components at up to 121,000 cph (IPC), and any combination in between. The machine is accurate to 7 µm at three
sigma for flip chips, die and wafer-level packages. Defect rates are less than one defect per million placements. The hybrid system has been designed to be versatile. Within a few minutes, it can be con- verted to switch production between SiP, embed- ded, FOWLP, FC-BGA, or regular SMT. This quick changeover includes recipe change, as well as transport and feeder setup. Placement force is fully controlled for thin dice and low-profile passives. The flip chips can
Extraction and Filtration for Electronics Mfg. from ULT
Löbau, Germany — ULT provides one of the most comprehensive range of turnkey and customized solutions for extraction and filtration systems in electronics manufacturing — in partic- ular for hard-to-purify fine dusts and particulates. Recently, the company intro-
duced its ULT Airtower, an efficient solution for welding fume extraction and filtration. The extractor is based on the layer ventilation principle, cur- rently the best method for air circula- tion. Contaminated air is aspirated,
have bump sizes as small as 30 µm, and can be supplied from multiple sources including tape-
and-reel, waffle pack, tray, and directly from the wafer. Passive chips can be as small as 008004 (0201 metric). K&S’ Hybrid 3 system, with three trolleys,
has a cleanroom footprint of 9.2 x 5.6 ft (2.8 x 1.7m), while the Hybrid 5 has a footprint of 12.1 x 5.6 ft (3.7 x 1.5m). The SiP market is growing fast. These devices
reduce PCB complexity and system costs. They also increase the reliability of equipment, such as mobile phones, wearables and devices for the
Internet of Things. Contact: Kulicke & Soffa Industries, Inc.,
1005 Virginia Drive, Fort Washington, PA 19034 % 215-784-6000 fax: 215-784-6001
Hybrid wafer feeder.
Web:
www.kns.com See at productronica, Hall A2 Booth 139
Advanced Wafer Level Bondtesting 4800 Bondtester
Advanced wafer testing
The most advanced bondtester on the market
Award winning
Wafer testing from 200mm to 450mm diameter
Automation software
Automatic edge lift chuck
Integrated debris removal station
4800 INTEGRA
ULT Airtower welding fume extractor.
filtered and then discharged as clean, breathable air at ground level, with no air drafts. The ULT Airtower is designed to provide a filtration rate of greater than 99.9 percent. Purified air is fed back into the
working environment, where it can be used for production hall heating. Specially-developed incident flow tech- nology in the filter cartridges, and the use of ventilators with integrated con- trollers, enables considerable power consumption reductions. Fully-auto- mated cartridge filter technology fur- ther reduces energy consumption. The Airtower is also extremely
quiet. The welding fume extractor is available in four different variants
from 2,950 to 11,700 cfm. Contact: ULT AG, Am
Gopelteich 1, 02708 Löbau, Germany % +49-3585-4128-0 fax: +49-3585-4128-11 E-mail:
ult@ult.de Web:
www.ult.de
See at productronica, Hall A4 Booth 549
www.nordsondage.com I
globalsales@nordsondage.com See at productronica, Hall A2 Booth 445
Automated on wafer testing
Virtually operator free testing Full SECS/GEM integration Automatic wafer justifier Cleanroom compatible
Learn more at
productronica A2.445
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