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October, 2017 MIRTEC Highlights MV-6 OMNI 3D AOI
Oxford, CT — MIRTEC’s MV-6 OMNI 3D AOI system is configured with the company’s exclusive OMNI- VISION® 3D inspection technology. It combines 15 MP CoaXPress cam- eras with the company’s eight-projec-
exclusive CoaXPress vision system, providing excellent image quality, accuracy and fast inspection rates. The machine uses dual-projec-
tion “shadow-free” 3D moiré technol- ogy, combined with a precision tele- centric compound lens and precision laser PCB war - page compensation to char- acterize each solder deposi- tion after screen printing. The MS-11e measures
MV-6 OMNI 3D AOI system.
tion digital multi-frequency moiré 3D system, in a newly-designed cost- effective platform. MIRTEC’s proprietary CoaX -
Press vision system is used in the company’s complete product range of 3D inspection systems. The eight- projection digital multi-frequency moiré technology is designed to pro- vide true 3D inspection, yielding height measurement data used to detect lifted component and lifted lead defects, as well as solder volume post-reflow. Fully configured, the MV-6 OMNI contains four 10 MP side-view cameras in addition to a 15 MP top-down camera. The MS-11e 3D SPI Machine is also configured with MIRTEC’s
solder volume, area, shape deformity, and x/y position and inspects for bridging between adjacent solder depositions. The MS-11e also provides real-time, closed-loop feedback to the screen printing system to eliminate defects before they can occur. The MV-3 OMNI
desktop 3D AOI machine
is configured with the company’s OMNI-VISION 3D inspection tech- nology. This combines the company’s 18 MP CoaXPress industrial camera system with its eight-projection digi- tal multi-frequency moiré 3D system in desktop platform. MIRTEC is also introducing its
MV-9 SIP system in package (SiP) inspection system. This machine spe- cializes in CSP components, and uses a 25 MP camera with combined 2D and 3D inspection technologies. The system is able to handle 0.004 to 0.12 in. (0.1 to 3 mm) thicknesses with a vacuum block. The company’s quality manage-
ment system software, INTEL - LISYS® is also on display. This soft-
ware suite promotes continuous process improvement by allowing manufacturers to track and elimi-
nate defects on inspected assemblies. Contact: MIRTEC Corp., 3 Morse Road, Oxford, CT 06478
% 203-881-5559 fax: 203-881-3322 E-mail:
bdamico@mindspring.com Web:
www.mirtec.com
See at productronica, Hall A2 Booth 329
IDENTCO Offers Durable Labeling Solutions
Ingleside, IL — INDENTCO® is now offering a range of labeling advance- ments and solutions, including a ther- mal transfer and die-cut parts materi- als portfolio, “economy vs. high-per- formance” strategy to manage PCB labeling costs, and auto-apply solu- tions. The company’s broad catalog of thermal transfer PCB assembly solu- tions includes stock blank labels, cus- tom blank and pre-printed labels, as well as options for presenting with auto-apply equipment. IDENTCO also offers an array of ribbons, printers, scanners, re-winders, dispensers and SMT label feeders. One of the newest products is
the company’s PPL line of polyimide labels for auto-application in the SMT production line. Precision die- cut labels on quick-release liners in the REEL-e™ format ensure static- free label delivery. Polyimide labels are designed
for high-temperature, harsh-environ- ment applications, but not all poly- imides are the same, and not all applications require the same level of durability and performance. IDENTCO works with cus-
tomers to determine which products will deliver the best fit for particular applications to deliver the lowest overall cost of ownership. EMS customers are continually
pushing for smaller labels to improve the traceability of their products. IDENTCO continues to engineer smaller formats, enabling printing and presenting for the tightest appli- cations.
Labels not only need to be print-
ed, but also applied. Applying labels manually at high rates is challenging and often results in inconsistent placement and poor adhesion. The company’s ELP-A auto-apply portfo- lio offers cost-effective solutions to ensure consistent label presentation at high rates. The applicators are designed to handle a broad range of sizes and shapes on a wide array of
automation systems. Contact: IDENTCO, 28164
Concrete Drive, Ingleside, IL 60041 % 815-385-0011 fax: 815-385-0359
E-mail:
jmorino@identco.com Web:
www.identco.com
See at productronica, Hall A2 Booth 331
DENON-USA.COM
All-IN-ONE Advanced Technology SMT Rework Station Compatible With Rework Of All SMT Components Compact & Stable, Designed for 7d/24h Shifts Wide support for industrial large-scale and small-scale circuit boards
RD-500V +1 619.601.6309 See at productronica, Hall A4 Booth 231
RD-500SV DEN-ON USA is the exclusive distributor of DEN-ON rework stations and accessories for the U.S., Canada, and Mexico.
1:25:39 PM
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