October, 2017


www.us-tech.com


Houston, TX — BPM Microsystems has introduced its new 4900 automated programming system (APS). The 4900, with its advanced chip-scale part (CSP) device handling, on-the-fly vision alignment, and HS400 programming speeds, satisfies a wide range of programming needs. With high-perform- ance laser marking and 3D inspection, the 4900 provides advanced serialization and quality con- trol, meeting the highest programming and cyber security standards for the automotive, aerospace, medical, industrial, and mobile device industries. The 4900 is powered by the company’s latest ninth-generation technology. This technology pro- grams eMMC in HS400 mode, the highest speed available, as well as HS200, DDR and SDR. The 4900 supports a high mix of devices on the same site, including microcontrollers, FPGA, eMMC, NAND, NOR, and serial flash, delivering speed and versatility in one system. Its CSP device handling capabilities include


BPM’s patent-pending Whisper - Teach™ technology, which fully auto- mates teaching of the smallest CSP devices. A new camera delivers vision alignment across the x, y and z axes, to accurately align small devices while in


Schleuniger Intros New Crimping Applicators


Manchester, NH — Schleuniger’s new Uni-M series of crimp applica- tors replaces the Uni-S series. The new applicator series provides a broader range of applications with improved delivery times. The Uni-M applicators provide the same ease of set up and precision as the compa- ny’s previous products. The new applicators can accom-


modate virtually all forms of stan- dard terminal types and carrier strips, with mechanical and pneu-


Page 91 BPM Intros New Automated Programming System


motion. The new alignment and positioning capabil- ities of the 4900 allow it to operate at full speed when handling CSP devices. The 4900 introduces a new hybrid laser that


combines fiber and Nd:YAG laser technologies for precision marking quality. Built-in mark verifica- tion and laser power monitoring at the point of mark ensure a consistent, damage-free mark on each device. The integrated 3D inspection system completes the 4900 by delivering full device pack- age validation after programming. Its 3D inspec- tion checks BGA, CSP, QFP, TSOP, SOIC, and J- Lead devices for coplanarity, bent leads, pitch,


width, diameter, standoff, and x/y errors. Contact: BPM Microsystems, 15000


Northwest Freeway, Houston, TX 77040 % 713-688-4600 E-mail: info@bpmmicro.com


4900 automated programming system.


Web: www.bpmmicro.com See at productronica, Hall A1 Booth 353


Uni-M series crimp applicator.


matic feed applicators. The series can accommodate insulated ferrules in continuous strip, splice terminals and Mylar tape terminals. The Uni-M series is offered at a


competitive price point for all appli- cations. Schleuniger’s processing machines are designed to accommo- date almost any wire application. Similarly, the new Uni-M line of crimping applicators can handle


almost any termination application. Contact: Schleuniger, Inc., 87


Colin Drive, Manchester, NH 03103 % 603-668-8117 fax: 603-668-8119


E-mail: sales@schleuniger.com Web: www.schleuniger-na.com


See at productronica, Hall A5 Booth 371, and


The ASSEMBLY Show, Booth 231, and


MD&M Minneapolis, Booth 729 See at productronica, Hall A2 Booth 270


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