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www.us-tech.com
October, 2017
KIC Intros Real-Time Analytics Dashboard
San Diego, CA — KIC’s new Vantage software is designed to help engi- neers gain insight into reflow and wave solder processes, enabling bet- ter and faster decision making. It is a real-time dashboard for thermal processes, accessible from any authorized PC or mobile device. The process information is automatically stored in a central location where engineers can quickly retrieve and share relevant data. Vantage delivers value to users,
Manufactured in the U.S.A. since 1966
www.westbond.com
1551 S. Harris Court Anaheim, CA 92806 Tel 714·978·1551
not through massive amounts of raw data, but through convenient access to relevant and actionable data. For example, with a few mouse clicks, the user can access traceability data for every assembled PCB within a certain timeframe, oven, shift, client name, or any combination of these filters. KIC is also offering its SPS
smart profiler, which collects profile data and compares it with the process specifications. Within sec- onds, the new smart profiler also suggests an improved reflow oven
setup. It uses smart factory technolo- gies to acquire and analyze thermal process for new insight and action-
KIC Vantage traceability and data analytics dashboard.
able data, leading to increased pro- duction line utilization, as well as reduced rework and electricity con- sumption.
Contact: KIC, 16120 W
Bernardo Drive, San Diego, CA 92127 % 858-673-6050 fax: 858-673- 0085 E-mail:
abailey@kicmail.com Web:
www.kicthermal.com
See at productronica, Hall A2 Booth 361
iTAC Showcases MES and IIoT Solutions
Southfield, MI — iTAC Software is now offering its
iTAC.MES.Suite 9.00.00, which includes numerous new functions. The new release con- tains the smart data analytics inte- gration service,
ITAC.SDA.Service, and the higher-level integrated ana- lytics platform, Apache Spark. The new Industrial Internet of
High mass, heat-sinking, lead-free PCBs have met their match.
PACE introduces the PH 100 low profile IR preheater for the most challenging PCBs
The PACE PH100 is a high powered (1600W), non-contact infrared heating system with an ergonomic, low-profile design which permits operators to safely pre-heat PCBs for fast, efficient soldering, rework or repair
Features:
• Sleek, incredibly low working height improves operator comfort and reduces fatigue, perfect for under microscope
• Intuitive 3.5" resistive Touch Screen Display for all operations • Large 300mm x 300mm (11.8" x 11.8") heating area
1-877-882-7223
www.paceworldwide.com
Things (IIoT) portal enables the visu- alization of process data from the ana- lytics platform, in combination with the MES master and transaction data. It is also possible to further opti- mize the overall equipment effective- ness (OEE) of production equipment.
iTAC.MES.Suite dockerized — the platform-independent, cloud-
capable version of
iTAC.MES.Suite 9.00.00 — has a service-oriented archi tecture, and is based on Docker’s container technology. It is available on leading IoT platforms, such as Microsoft Azure, AWS and IBM Bluemix. The MES services provided by
iTAC.MES.Suite dockerized, such as quality analysis, automatic material feed control and simultaneous multi- resource planning, can be used in the public cloud, on premises or as an
edge device solution. Contact: iTAC Software, Inc.,
26801 Northwestern Highway, Southfield, MI 48033 % 248-450- 2446 Web:
www.itacsoftware.de
See at productronica, Hall A3 Booth 140 New High-Speed Die Bonder from MRSI
North Billerica, MA — MRSI Systems has recently launched a new high-speed die bonder, the MRSI- HVM3. The system is aimed at high- volume photonics manufacturing. The new die bonder incorporates
Soldering, Desoldering and Rework Solutions Since 1958. See at productronica, Hall A4 Booth 504
the latest hardware and software innovations. Equipped with fast-ramp eutectic stations, it deploys multiple levels of parallel processing, using dual gantries, dual heads, dual bond- ing stages, and on-the-fly tool changes. The same across all of the company’s products, MRSI’s software makes it easy for users to change process set- tings for new parts, processes and products. These features provide cus- tomers with excellent throughput for capacity expansion, high accuracy for high-density packaging and flexibility for multi-chip, multi-process produc- tion in one machine. The MRSI-HVM3 high-speed die bonder supports many applications, including chip-on-carrier (CoC), chip-on-submount (CoS) and chip-on-baseplate or board (CoB). High-volume manufacturing of
photonic, sensor and semiconductor devices requires a die bonding system that can deliver speed without sacri- ficing precision and flexibility. The
High-speed die bonder.
new MRSI-HVM3 die bonder was built to address this challenge. The system leverages a well-defined set of MRSI’s core competencies, in such areas as system design, software development, machine vision, motion control, industrial automation, and
process solutions. Contact: MRSI Systems, 101
Billerica Avenue, Suite 3, North Billerica, MA 01862 % 978-667-9449 E-mail:
sales@mrsisystems.com Web:
www.mrsisystems.com
See at productronica, Hall B2 Booth 401
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