October, 2017


www.us-tech.com


Page 47


San Jose, CA — Sanmina Corporation’s back- plane and cable division has developed new flex and rigid flex circuit assembly capabili- ties for military and aerospace electronics equipment. This new technology combines the latest laminates, high-performance mili- tary and aerospace connectors and Sanmina’s advanced circuit fabrication technologies. These advancements, along with the


company’s system design and manufacturing in AS9100C-certified circuit facilities, offer a complete solution for advanced defense and aerospace applications. Flex and rigid flex circuits have been


used as a cost-effective interconnect system in mission-critical defense and aerospace equipment for many years. As these systems evolve and data rates increase, performance requirements for interconnects have become more demanding.


BlueRing Stencils: Wide Selection of Printing Products


Lumberton, NJ — BlueRing Stencils, formed by the merger of FLS and MET, offers a broad portfolio of printing products and services. All of the company’s products are designed to improve first-pass yields and to mitigate assembly defects. BlueRing’s NanoSlic gold-coat-


ed stencil has quickly emerged as an excellent coating technology for im- proved solder paste transfer efficien- cy. NanoSlic was developed to reduce underside cleaning requirements and to increase overall printing yield. The company also offers board


design and development through root cause analysis and CAD-matic serv- ices. BlueRing Stencils’ products and manufacturing methods undergo ex- tensive research and development in an advanced SMT printing lab. At SMTA International 2017,


the company’s stencil technology manager, Greg Smith, was part of a technical conference and gave a pres- entation titled “Impact of Stencil Foil Type on Solder Paste Transfer Effi- ciency for Laser Cut SMT stencils.” The paper investigated laser cut wall quality on different foils, as well as the effectiveness of various foil types in relation to solder paste printing


both with and without nano-coatings. Contact: BlueRing Stencils, 140


Mt. Holly Bypass, Unit 10, Lumber- ton, NJ 08048 % 866-763-3873 E- mail: greg@blueringstencils.com Web: www.blueringstencils.com


Run with us.


There is no better way to reach the Electronic High Tech and Manufacturing Community than


advertising in U.S. Tech. www.us-tech.com.


Mil /Aero Flex and Rigid Circuit Assembly from Sanmina High-performance connectors are used, includ-


ing D38999, D-sub Micro-D and blind mate connec- tors. Sanmina can also use flex circuit laminate ma- terials with these high-speed connectors in demand- ing applications. The company’s flex and rigid flex technology in these applications results in a smaller form factor, reduced weight and cost savings. The company’s new flex and rigid flex circuit fabrication technology is able to deliver data rates up to 15 Gb/s. Sanmina offers a complete solution for back-


planes, PCBs and flex circuits, including systems engineering, board design and layout, in-house laminate qualification, signal integrity, high-speed connector analysis, and failure analysis laborato- ries. Sanmina’s global facilities are fully certified


for defense and aerospace contracts. Contact: Sanmina Corp., 2700 N First Street,


High-performance MIL//aero circuit assembly.


San Jose, CA 95134 % 408-964-3500 fax: 408-964- 3440 Web: www.sanmina.com


See at productronica, Hall A3 Booth 102/5


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