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October, 2017
Scienscope Demonstrates Full X-Ray Lineup
Chino, CA — Scienscope Internation- al is demonstrating a full range of X- ray systems, including its X-Scope 2000, X-SPECTION 6000 and AXC- 800 X-ray component counter, at pro- ductronica 2017.
The X-SPECTION 6000 X-ray inspection system is Sci- enscope’s most advanced cabinet-style X-ray in- spection system. It con- tains an integrated 130 kV micro-focus, high- power, closed X-ray tube and 5 x 5 in. (12.7 x 12.7 cm) or 4 x 3 in. (10.2 x 7.6 cm) high-resolution, digi- tal, flat-panel CMOS image detectors. The sys- tem also has 60° camera tilt for oblique angle view- ing and a rotating work table.
The X-Scope 2000 is a
can handle up to four 7 in. (17.8 cm) reels at a time, or a single 13 or 15 in. (33 or 38 cm) reel. The AXC-800 can count devices on JEDEC trays and in- side ESD storage bags.
It can be used with barcode reading and label printing in order to
X-SPECTION 6000 X-ray inspection system.
fully-featured, high-performance X- ray inspection system with an excel- lent price-to-performance ratio. The system is equipped with a 90 kV high- power, closed X-ray tube and 4 x 3 in. (10.2 x 7.6 cm) high-resolution, digital, flat-panel CMOS image detector. The system also offers 50° camera tilt. The tabletop AXC-800 is an auto- matic X-ray component counter, de- signed for the inspection of compo- nents on traditional reels, from 01005 (0402 metric) to odd-form devices. It
manage and track inventory with 100 percent confidence. Data also can be transferred directly to inven- tory management systems and vari- ous types of factory control software. Contact: Scienscope Internation- al Corp., 5751 Schaefer Avenue, Chino, CA 91710 909-590-7273 fax: 909-494-5513
E-mail:
toneil@scienscope.com Web:
www.scienscope.com
See at productronica, Hall A1 Booth 402
MVP to Show Latest Microelectronics, Semiconductor
and SMT Inspection Equipment Carlsbad, CA — Machine Vision Products, Inc., (MVP) is now offering its latest lineup of AOI systems for microelectronics, semiconductor and SMT assembly.
The latest version of the 850G AOI system for microelectronics of- fers enhanced tools to achieve high defect coverage for wirebond, die and wafer applications presented in lead frame, tray or wafer formats. Using MVP’s latest 6.6 software and multi- ple sensor technologies, the company provides inspection and metrology for a broad range of applications. Inspection techniques include high-resolution telecentric imaging, quad-color lighting, and 3D tech- niques to provide defect detection and measurement for lead frame, die, epoxy, and wirebond inspection. The company has also intro- duced a new version of its AutoNet- worker, a centralized database with the flexibility to be configured for many microelectronics and SMT traceability needs. The new version can record images and parametric data, and pass or fail each product. The latest image archiving ca- pability provided by AutoNetworker allows customers to save every defect image from multiple AOI systems. For demanding processes where high quality is critical, visual traceability along with data traceability is a great benefit.
See at productronica, Hall B2 Booth 517
The MVP 2020 DWMS (die wire metrology system) is a new dedicated lead frame inspection AOI system that uses advanced optic and han- dling solutions to provide the latest in die and wirebond inspection. The system is configured as standard
with the company’s lead frame mag- azine loaders and unloaders, which are designed for error-free operation at high throughput.
The MVP Spectra offers the largest board inspection area of all of the company’s AOI systems. The sys- tem can handle a 35 x 35 in. (89 x 89 cm) board. With board staging, the
MVP 850G microelectronics inspection system
system can handle even larger prod- ucts. The system provides robust ma- terial handling to allow the inspec- tion of heavy devices.
The company’s Supra E and Ultra V systems are the AOI work- horses of many high-volume manu- facturers worldwide. These plat- forms provide a cost-effective AOI so- lution for SMT production of PCBs up to 20 x 20 in. (51 x 51 cm) in size. These systems provide both 2D and 3D inspection for SMT device and solder paste. Contact: Machine Vision Prod- ucts, Inc., 5940 Darwin Court, Carlsbad, CA 92008 760-438-1138 E-mail:
sales@visionpro.com Web:
www.visionpro.com
See at productronica, Hall A2 Booth 270
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