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October, 2017 THE NEW
BENCHMARK IN WIRE STRIPPING
AMICRA Unveils Precision Die and Flip Chip Bonder
Sunnyvale, CA — AMICRA has launched a new die and flip chip bon- der. The NANO is designed for high- ly-demanding assembly tasks. Reportedly the highest-precision placement system in its class, the NANO supports a ±0.3 µm place- ment accuracy at full speed and three sigma. The NANO offers many fea-
tures, including: quantitative par- allelism calibration for large panel handling; eutectic, epoxy and UV bonding; UV dispensing; and in-situ curing. The available dispensing options support all common dis- penser technologies, as well as material traceability. The system has three different
The
Mira 230 has a new robust and
sturdy design that supports an extraor- dinary processing range from AWG 32 to AWG 8. It sets a new benchmark by its unique sequencing capabilities that can be stored in a library for quick reproduction. The Mira 230 can strip and cut inner conductors with a variety of parameters without a program change. It comes equipped with a simple graphical user interface that ensures a quick learning process.
komaxwire.com See at productronica, Hall A5 Booth 211
heating options and is equipped for laser soldering and active bond force control. Compared with the compa- ny’s previous AFC version, the NANO alignment optics are signifi- cantly improved. The machine is built on a vibration-free, high-quality granite platform. The NANO enables the reliable handling of ultra-small and very thin dice. Besides high-precision die attachment systems, such as the die
and flip-chip bonders AFC Plus and NOVA Plus, AMICRA’s product port- folio includes high-speed dispensing systems for globe-top, underfill, dam- and-fill, and automated wafer inking
NANO die and flip chip bonder. systems (AIS, SIS), along with cus-
tomized solutions. Contact: AMICRA Microtechnologies, Inc., 1250 Oakmead Parkway, Suite 210,
Sunnyvale, CA 94085 % 408-418-4681 fax: 408-418-4682 E-mail:
sales@amicra.com Web:
www.amicra.com
See at productronica, Hall B2 Booth 306
DIT-MCO Intros Handheld Wireless Cable Tester
Kansa City, MO — DIT-MCO has launched a new portable, handheld cable tester, HT-128. While it can be used as a benchtop cable tester for small assemblies, HT-128’s main purpose is to test installed wiring harnesses, without having to use long extension cables or loop-back plugs to bring both ends of a cable back to the tester. The HT-128’s small, compact
size, like that of a common handheld DMM, belies the fact that it is a com- plete 128-point cable tester, capable
Intelligent Dry Storage™
of testing for opens, shorts and mis- wires in seconds. Up to eight units can be combined together for testing branch harnesses, with a total capa-
HT-128 handheld wireless cable tester.
bility of 1,024 test points. Short adapter cables are used to connect each HT-128 to the UUT’s (unit under test) connectors. One unit is the host and the others become the remote. The test program is started from the host unit and the harness is fully tested as if both ends are plugged into one tester. The units communicate wirelessly, or can com- municate through the wires of the cable under test. In addition to the HT-128, DIT-
MCO offers its benchtop, high-volt- age wiring analyzer, model 2115, a modular wire harness tester, model 2650, capable of testing complex wiring assemblies up to 100,000 points, and the Voyager intermittent tester, which can detect intermittent wiring defects as short as 50
™
www.smartdry.com | Productronica 2017 Hall A4 Booth #532 See at productronica, Hall A4 Booth 532
nanoseconds in duration. Contact: DIT-MCO
International, 5612 Brighton
Terrace, Kansas City, MO 64130 % 816-444-9700 fax: 816-444-6843 E-mail:
infolink@ditmco.com Web:
www.ditmco.com
See at productronica, Hall A3 Booth 102/2
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