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Page 98


www.us-tech.com


October, 2017 ASM Presents Flexible Smart Factory Solutions


Suwanee, GA — ASM Assembly Systems is presenting solutions for all areas of electronics production at pro- ductronica 2017. New products include improved SIPLACE TX high- speed placement modules and SIPLACE placement heads, a new JEDEC tray feeder, and innovations like the ASM Production Planner, off- line printer programming, onboard PCB inspection, touchless placement,


Smart, optimized and heavily-


automated workflows provide the greatest efficiency benefits to elec- tronics production. With eight core processes, ASM is able to show how the right combination of hardware of software can automate and improve processes. The portfolio includes four line


workflows (planning, virtual produc- tion, process optimization, and pro-


gramming. With the ASM Pro - duction Planner, users can im port jobs from their ERP and MES sys- tems so that setups can be scheduled and optimized across multiple lines with SiCluster MultiLine. With off-line printer program-


ming, users can create printing pro- grams off-line and store them in a cen- tral database irrespective of specific lines and configurations. This reduces prep time on the line, as well as pro- gram selection errors. Before the pro- grams are downloaded to the printer, the system checks whether the print- er’s equipment and configuration are suitable for the respective job. With SIPLACE OIB as an open


machine interface and HERMES as an open data standard and SMEMA successor for non-proprietary com- munication between line compo-


nents, ASM is pursuing a transpar- ent data integration strategy on the shop floor. ASM is also offering informa-


tion about advanced packaging — the assembly of chips into subsystems with combinations of bare dice, flip- chips and SMT components. The company’s experts expect many EMS companies to expand into this lucra- tive growth market over the coming months and years as it displaces con-


ventional wirebonding. Contact: ASM Assembly


Systems, LLC, 3975 Lakefield Court, Suite 106, Suwanee, GA 30024 % 770-797-3000 fax: 770-797-3457 E-mail: easales.sea@asmpt.com Web: www.siplace.com


See at productronica, Hall A3 Booth 377


MacDermid Develops Microvia Filling Process


ASM offers eight integrated workflows for the production line and factory.


and the SIPLACE Command Center. With the HERMES and ADA -


MOS initiatives, ASM is underscor- ing its role in open data integration and the Industrial Internet of Things (IIoT). ASM has also developed a complete chain of solutions for advanced packaging that enables electronics manufacturers to enter an attractive growth market.


duction run) and four factory work- flows (material management, prepa- ration, factory monitoring, and facto- ry integration). For all eight workflows, ASM


offers innovations that make users’ processes more effective and effi- cient. Two examples from workflow planning are the ASM Production Planner and off-line printer pro-


Waterbury, CT — MacDermid Enthone Electronics Solutions has released its MacuSpec AVF 700 process. AVF 700 is a high-perform- ance electrolytic copper metallization process for the filling of PCB microvias. AVF 700 allows for the removal


of conventional process steps, such as flash plate, micro-etch and predip, while providing a stronger direct cop- per-to-copper bond for enhanced via reliability. With AVF 700, customers gain


all of these benefits with a very low amount of surface copper plating, requiring little to no post-processing


thickness reduction. Combined with the company’s direct metallization solutions, such as Shadow and Blackhole, MacDermid provides cost savings, environmental benefits, and improved performance and reliabili- ty. MacuSpec AVF 700 is an advanced via fill choice for “any-


layer” HDI designs. Contact: MacDermid, Inc., 227


Freight Street, Waterbury, CT 06702 % 203-575-5661 fax: 203-575- 7916 E-mail: deanna.cullen@mac- dermidenthone.com Web: www.mac- dermidenthone.com/electronics


See at productronica, Hall B3 Booth 272


Connecting Global Competence Buy tickets now!


Sp Special Shows


World’s Leading Trade Fair for Electronics Development and Production November 14–17, 2017 | Messe München | productronica.com


Contact: German American Chamber of Commerce, Inc. Tel. +1 646 437 1013 | kvogelsang@munich-tradefairs.com


Co-located event


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